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Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers
Advanced Materials Interfaces ( IF 4.3 ) Pub Date : 2018-01-15 , DOI: 10.1002/admi.201701285 Yousef Farraj 1 , Michael Layani 2 , Avi Yaverboim 3 , Shlomo Magdassi 1
Advanced Materials Interfaces ( IF 4.3 ) Pub Date : 2018-01-15 , DOI: 10.1002/admi.201701285 Yousef Farraj 1 , Michael Layani 2 , Avi Yaverboim 3 , Shlomo Magdassi 1
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3D printed electronics is an emerging field of high importance in both academic research and industrial manufacturing. It enables fabrication of 3D devices with embedded or conformal electronic circuits, which are relevant to a variety of applications, such as Internet of things, soft robotics, and medical devices. Patterning of electrical conductors with conductivity higher than 50% bulk copper is challenging and usually involves electroless or electrolytic deposition processes that require the use of very costly catalyst, mainly palladium, as a seed material. Here, the use of a binuclear copper complex as a very efficient replacement for the conventional catalysts, which can be directly inkjet printed onto 3D plastic objects, is described. After printing, the copper complex is converted into pure copper upon short exposure to low‐temperature plasma. By combining the binuclear complex with electroless plating, resistivity as low as 2.38 µΩ cm, which corresponds to a 72% conductivity of bulk copper, is obtained. The applicability of the complex ink and the process is demonstrated in the fabrication of a near‐field communication antenna on a 3D printed plastic object.
中文翻译：
双核铜络合物油墨作为化学镀铜的种子，在3D打印聚合物上的体积电导率> 70％
3D打印电子学在学术研究和工业制造中都是一个高度重要的新兴领域。它可以制造具有嵌入式或共形电子电路的3D设备，与各种应用相关，例如物联网，软机器人和医疗设备。具有大于50％的体积铜的电导率的电导体的图案设计具有挑战性，通常涉及化学沉积或电解沉积工艺，这些工艺需要使用非常昂贵的催化剂（主要是钯）作为种子材料。在此，描述了使用双核铜络合物作为常规催化剂的非常有效的替代方法，该方法可以直接喷墨印刷到3D塑料物体上。打印后，短时间暴露于低温等离子体后，铜络合物将转化为纯铜。通过将双核络合物与化学镀结合，可获得低至2.38 µΩ cm的电阻率，相当于本体铜的72％电导率。在3D打印的塑料物体上制造近场通信天线，证明了复杂油墨和工艺的适用性。
更新日期：2018-01-15
中文翻译：
双核铜络合物油墨作为化学镀铜的种子，在3D打印聚合物上的体积电导率> 70％
3D打印电子学在学术研究和工业制造中都是一个高度重要的新兴领域。它可以制造具有嵌入式或共形电子电路的3D设备，与各种应用相关，例如物联网，软机器人和医疗设备。具有大于50％的体积铜的电导率的电导体的图案设计具有挑战性，通常涉及化学沉积或电解沉积工艺，这些工艺需要使用非常昂贵的催化剂（主要是钯）作为种子材料。在此，描述了使用双核铜络合物作为常规催化剂的非常有效的替代方法，该方法可以直接喷墨印刷到3D塑料物体上。打印后，短时间暴露于低温等离子体后，铜络合物将转化为纯铜。通过将双核络合物与化学镀结合，可获得低至2.38 µΩ cm的电阻率，相当于本体铜的72％电导率。在3D打印的塑料物体上制造近场通信天线，证明了复杂油墨和工艺的适用性。
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