A novel Mg/TiNiCu composite was successfully fabricated from porous TiNiCu shape memory alloy (SMA) and pure Mg via non-pressure infiltration process with the aim of developing a new kind of high damping material with excellent mechanical properties. In order to restrain the formation of undesired Mg₂Cu phase, the methods of short-time infiltration and rapid consolidation were adopted. Resultant material had homogenously distributed and 3D interconnected Mg particles in the TiNiCu matrix. Compared with porous TiNiCu SMA, in addition to the notable increase of storage modulus the damping property of Mg/TiNiCu composite was also obviously improved, which could be attributed to the superposition effect of multiple damping sources.

以多孔TiNiCu形状记忆合金（SMA）和纯Mg为材料，通过无压浸渗工艺成功制备了新型的Mg / TiNiCu复合材料，旨在开发一种新型的具有优良机械性能的高阻尼材料。为了抑制不希望的Mg ₂ Cu相的形成，采用了短时渗透和快速固结的方法。所得材料在TiNiCu基体中具有均匀分布的3D互连Mg颗粒。与多孔TiNiCu SMA相比，Mg / TiNiCu复合材料除了显着提高储能模量外，其阻尼性能也得到了明显改善，这归因于多种阻尼源的叠加作用。