Abstract The formation of Al/Mg intermetallic compounds (IMCs) of Al3Mg2 and Al12Mg17 was successfully avoided through ultrasonic assisted transient liquid phase bonding Mg/Al using pure Sn interlayers. A new IMC of Mg2Sn formed in the joints. Different bonding parameters were used to control the formation of Mg2Sn. The optimum joint shear strength of 60.0 MPa was obtained at the temperature of 220 °C, ultrasonic power of Mode I and ultrasonic time of 4 s. The thickness of Mg2Sn should be depressed to less than 15% of the joint width. Joints were fractured through the Mg2Sn layer.

中文翻译：

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通过超声波辅助的 Mg 与 Al 的瞬态液相键合控制 Mg 2 Sn 的形成

摘要 通过使用纯锡夹层的超声辅助瞬态液相键合 Mg/Al，成功避免了 Al3Mg2 和 Al12Mg17 的 Al/Mg 金属间化合物 (IMCs) 的形成。在接头中形成了新的 Mg2Sn IMC。使用不同的键合参数来控制 Mg2Sn 的形成。在温度为 220 ℃、超声功率为 I 型、超声时间为 4 s 的条件下，获得了 60.0 MPa 的最佳接头剪切强度。Mg2Sn 的厚度应低于接头宽度的 15%。接头通过 Mg2Sn 层断裂。