The dielectric barrier discharge (DBD) non-thermal plasma was used to modify the phosphoric acid activated carbon (AC) for enhancing its adsorption performance of Cu(II). The BET, SEM-EDX, FT-IR, elemental analysis and XPS techniques were employed to determine the textural structure and surface chemistry of the raw and plasma modified ACs. The results indicate that the ACs after using plasma modification have much higher Cu(II) adsorption capacity, irrespective of different adsorption conditions, such as solution pH, temperature, dosage and agitation speed. Importantly, the adsorption capacity of Cu(II) on AC has a non-monotonic variation (increasing at first and then decreasing) with the plasma modification time. The optimum modification time was 7.5 min in this study and the Cu(II) adsorption capacity of the modified AC could be improved by about 150% compared to that of the raw AC. Interestingly, the Cu(II) adsorption capacity showed good exponential relationship with the content of carboxylic groups, while it showed significant linear relation with the quantity of phosphates and pyrophosphates groups, indicating that these functional groups play key roles on Cu(II) adsorption. Furthermore, plasma modification improved Cu(II) removal regeneration performance of AC.

介质阻挡放电（DBD）非热等离子体用于修饰磷酸活性炭（AC），以增强其对Cu（II）的吸附性能。BET，SEM-EDX，FT-IR，元素分析和XPS技术被用来确定未经处理和经等离子体改性的AC的组织结构和表面化学性质。结果表明，采用等离子改性后的ACs具有更高的Cu（II）吸附能力，而与溶液pH，温度，剂量和搅拌速度等不同的吸附条件无关。重要的是，随着等离子体改性时间的增加，Cu（II）在AC上的吸附容量具有非单调变化（先增大然后减小）。最佳修改时间为7。在本研究中5分钟，与原始AC相比，改性AC对Cu（II）的吸附能力可提高约150％。有趣的是，Cu（II）的吸附容量与羧基含量呈良好的指数关系，而与磷酸根和焦磷酸根的数量呈显着线性关系，表明这些官能团在Cu（II）吸附中起关键作用。此外，等离子体改性改善了AC的Cu（II）去除再生性能。表明这些官能团在Cu（II）吸附上起关键作用。此外，等离子体改性改善了AC的Cu（II）去除再生性能。表明这些官能团在Cu（II）吸附上起关键作用。此外，等离子体改性改善了AC的Cu（II）去除再生性能。