Tin was electrodeposited from chloride solutions using a membrane cell under ultrasonic waves. Cyclic voltammetry(CV), linear sweep voltammetry(LSV), chronoamperometry(CHR), and chronopotentiometry were applied to investigate the electrochemical mechanism of tin electrodeposition under ultrasonic field. Chronoamperometry curves showed that the initial process of tin electrodeposition followed the diffusion controlled three-dimensional nucleation and grain growth mechanism. The analysis of the cyclic voltammetry and linear sweep voltammetry diagrams showed that the application of ultrasound can change the tin membrane electro-deposition reaction from diffusion to electrochemical control, and the optimum parameters for tin electrodeposition were H⁺ concentration 3.5 mol·L^-1, temperature 35°C and ultrasonic power 100 W. The coupling ultrasonic field played a role in refining the grain in this process. The growth of tin crystals showed no orientation preferential, and the tin deposition showed a tendency to form a regular network structure after ultrasonic coupling. While in the absence of ultrasonic coupling, the growth of tin crystals has a high preferential orientation, and the tin deposition showed a tendency to form tin whiskers. Ultrasonic coupling was more favorable for obtaining a more compact and smoother cathode tin layer.

使用膜盒在超声波下从氯化物溶液中电解沉积锡。利用循环伏安法，线性扫描伏安法，计时安培法和计时电位法研究了超声场下锡电沉积的电化学机理。计时电流法曲线表明，锡电沉积的初始过程遵循扩散控制的三维成核和晶粒长大机制。对循环伏安法和线性扫描伏安法图的分析表明，超声波的应用可以改变锡膜的电沉积反应，从扩散转变为电化学控制，电沉积锡的最佳参数为H ⁺浓度3.5mol·L ^-1温度为35°C，超声功率为100W。在此过程中，耦合超声场在细化晶粒方面发挥了作用。锡晶体的生长没有取向优先，并且在超声耦合后锡沉积表现出倾向于形成规则的网络结构的趋势。在没有超声耦合的情况下，锡晶体的生长具有较高的优先取向，并且锡沉积显示出形成锡晶须的趋势。超声耦合更有利于获得更致密和更光滑的阴极锡层。