Abstract A low-pressure abrasive flow polishing (LAFP) technology is presented to address the issue of fabricating rectangular microgroove of Cu and SUS304 materials. The effects of abrasive flow on the polishing efficiency and uniformity are analyzed numerically and experimentally. The rectangular structure of polishing microchannel is designed and optimized by simulating the trajectory and erosion action of particles using computational fluid dynamics (CFD) model. The distributions of turbulence intensity and shear force in the polishing microchannel are analyzed. Polishing experiments are conducted to fabricate microgrooves on Cu and SUS304 materials. The experimental results reveal the increase of material removal with the increase in particle size, polishing pressure, and particle concentration. Surface roughness of Ra 4.8 nm and Ra 12.7 nm are respectively obtained when polishing the rectangular microgroove of Cu and SUS304 materials. Simulation and experimental results show that LAFP using polishing microchannel can fabricate microstructures with high-quality surface.

中文翻译：

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矩形微槽低压磨粒流抛光数值与实验研究

摘要 针对Cu和SUS304材料矩形微槽加工问题，提出了一种低压磨粒流抛光(LAFP)技术。数值和实验分析了磨料流对抛光效率和均匀性的影响。通过使用计算流体动力学（CFD）模型模拟​​颗粒的轨迹和侵蚀作用，设计并优化了抛光微通道的矩形结构。分析了抛光微通道中湍流强度和剪切力的分布。进行抛光实验以在 Cu 和 SUS304 材料上制造微槽。实验结果表明，随着粒度、抛光压力和颗粒浓度的增加，材料去除率增加。表面粗糙度为 Ra 4.8 nm 和 Ra 12。抛光Cu和SUS304材料的矩形微槽时分别获得7 nm。模拟和实验结果表明，使用抛光微通道的 LAFP 可以制造具有高质量表面的微结构。