当前位置: X-MOL 学术Small Methods › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
3D Printing of Flexible Electronic Devices
Small Methods ( IF 10.7 ) Pub Date : 2017-11-20 , DOI: 10.1002/smtd.201700259
Hui Yang 1 , Wan Ru Leow 1 , Xiaodong Chen 1
Affiliation  

Compared to traditional , simple, planar or tubular flexible devices fabricated by spin‐coating, casting, or extrusion, 3D‐printed flexible electronic devices possess complicated geometries with precisely prescribed microarchitectures and excellent mechanical properties for satisfying all kinds of individual requirements. However, the full utilization of 3D‐printing technology to realize 3D‐printed flexible electronic devices remains limited by the flexibility and conductivity of 3D‐printing materials. To achieve 3D‐printed flexible electronic devices, the flexibility of 3D‐printed flexible devices and functionalization of conductive materials or hard silicon‐based electronic devices are combined. These 3D‐printed flexible electronic devices can be applied widely in the fields of personal wearable devices, prosthetic organs for the disabled, and human–computer interfaces. To further promote the rapid advent of 3D‐printed flexible electronic devices, the recent strategies and future developmental directions of fabricating these complex electronic devices are discussed here.

中文翻译:

柔性电子设备的3D打印

与通过旋涂,浇铸或挤压制造的传统的,简单的,平面的或管状的柔性设备相比,3D打印的柔性电子设备具有复杂的几何形状,精确规定的微结构和出色的机械性能,可以满足各种个性化需求。但是,由于3D打印材料的灵活性和导电性,仍然无法充分利用3D打印技术来实现3D打印的柔性电子设备。为了实现3D打印的柔性电子设备,将3D打印的柔性设备的灵活性与导电材料或基于硬硅的电子设备的功能结合在一起。这些3D打印的柔性电子设备可广泛应用于个人可穿戴设备,残疾人假肢,和人机界面。为了进一步促进3D打印的柔性电子设备的快速出现,在此讨论了制造这些复杂电子设备的最新策略和未来的发展方向。
更新日期:2017-11-20
down
wechat
bug