Abstract The corrosion of copper in aqueous solutions containing ≥5 × 10 −4 mol/L sulphide and the ensuing accumulation of corrosion product deposits (as chalcocite Cu 2 S) occurs non-uniformly indicating the occurrence of microgalvanic coupling between net anodic and net cathodic surface locations. A series of novel electrochemical experiments were designed to confirm the occurrence of this process and a series of analytical procedures used to identify the chemical nature of the transported Cu species. Transport was found to occur as copper sulphide complexes and clusters. It was also demonstrated that all the available sulphide was sequestered as deposited Cu 2 S.

中文翻译：

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铜在厌氧硫化物水溶液中腐蚀期间的铜迁移和硫化物封存

摘要 铜在含 ≥5 × 10 -4 mol/L 硫化物的水溶液中的腐蚀和随之而来的腐蚀产物沉积物（如辉铜矿 Cu 2 S）的不均匀发生表明净阳极和净阴极之间发生微电流耦合。表面位置。设计了一系列新颖的电化学实验来确认该过程的发生，并设计了一系列用于识别传输的 Cu 物质的化学性质的分析程序。发现运输以硫化铜络合物和簇的形式发生。还证明所有可用的硫化物都被隔离为沉积的 Cu 2 S。