Abstract This paper focuses on evaluating the influence of thick films on the electrical properties of ceramic substrates, especially their dielectric strength. Dielectric strength is one of the most important parameters of the substrates used in power electronics. Increasing the thickness of the conductive films on these substrates is necessary to achieve sufficient current capability. The glass phase of thick film metal pastes, particularly if they are printed and fired several times on the same area of the substrate, can significantly affect the dielectric strength value and other electrical parameters (resistivity, dielectric constant) of the substrates. The change of the substrate parameters using different thicknesses of copper (thick printed copper) and silver films is described in this paper.

中文翻译：

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铜基和银基薄膜对氧化铝基板电性能的影响

摘要 本文重点评估厚膜对陶瓷基板电性能的影响，尤其是介电强度。介电强度是电力电子中使用的基板的最重要参数之一。增加这些基板上导电膜的厚度对于获得足够的电流能力是必要的。厚膜金属浆料的玻璃相，特别是如果它们在基板的同一区域上印刷和烧制多次，会显着影响基板的介电强度值和其他电气参数（电阻率、介电常数）。本文描述了使用不同厚度的铜（厚印刷铜）和银膜的基板参数的变化。