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Growth of SiOC/SiC nanostructures from cured polysiloxane-silica composite
Ceramics International ( IF 5.1 ) Pub Date : 2018-02-01 , DOI: 10.1016/j.ceramint.2017.11.095
K. Indulekha , Deepthi Thomas , R.S. Rajeev , K.N. Ninan , C. Gouri

Abstract SiOC/SiC nanostructures were produced by the pyrolysis of silica reinforced silicone polymer cured through platinum catalyzed hydrosilylation route. The base polymers used were vinyl terminated poly(dimethyl-co-diphenyl) siloxane (V-PMPS) and trimethylsilyl terminated poly(dimethyl-co-diphenyl-co-methyl hydrogen) siloxane (TMS-PMPHS). While TMS-PMPHS was synthesised from non-halogenated precursors by acid catalyzed ring opening/co-condensation approach, V-PMPS was used as received. The cured polymers were characterised for their spectral and thermal properties. Incorporation of silica filler to V-PDMS resulted in composite with higher onset of decomposition temperature compared to the unfilled counterpart. Pyrolysis of the filled polymer was carried out at different temperatures and the products were analysed by FTIR, Raman spectroscopy, XRD, FESEM and EDAX. It was found that one dimensional ceramic nanostructures are produced from the silica filled composite at lower temperature of 900 °C compared to the unfilled system. The size of the nanostructures increased with increase in the pyrolysis temperature.

中文翻译:

从固化的聚硅氧烷-二氧化硅复合材料中生长SiOC/SiC纳米结构

摘要 SiOC/SiC 纳米结构是通过铂催化氢化硅烷化途径固化的二氧化硅增强有机硅聚合物的热解制备的。所用的基础聚合物是乙烯基封端的聚(二甲基-共-二苯基)硅氧烷(V-PMPS)和三甲基甲硅烷基封端的聚(二甲基-共-二苯基-共-甲基氢)硅氧烷(TMS-PMPHS)。虽然 TMS-PMPHS 是通过酸催化开环/共缩合方法由非卤化前体合成的,但 V-PMPS 按原样使用。固化聚合物的特征在于它们的光谱和热性能。与未填充的对应物相比,将二氧化硅填料掺入 V-PDMS 导致复合材料具有更高的分解开始温度。在不同温度下对填充聚合物进行热解,并通过 FTIR、拉曼光谱、XRD、FESEM 和 EDAX。发现与未填充系统相比,一维陶瓷纳米结构是在 900 °C 的较低温度下由二氧化硅填充复合材料生产的。纳米结构的尺寸随着热解温度的增加而增加。
更新日期:2018-02-01
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