Abstract We have prepared semi-crystalline polyamide (PA) thermosets using reactive side-group functionalized copolyamides as precursors. Reactive meta- and para-based phenylethynyl diacid chlorides (IPE and TPE) were synthesized and incorporated in poly(decamethylene terephthalamide) (PA 10T) using a low temperature solution polymerization method. The phenylethynyl-based comonomers disrupt crystallization of the final copolyamides and lower the onset of melting. Copolyamides containing 5, 10 and 15 mol% of the reactive comonomer could be cured at 350 °C into freestanding PA thermoset films. All thermoset films are stable up to 400 °C, as confirmed by DMTA, which is the result of network formation. The thermosets exhibit both a crystalline phase and a crosslinked amorphous phase. Depending on the concentration of the side-groups, the degree of crystallinity of the final thermosets can be controlled and suppressed by 52–76% compared to the PA 10T reference polymer. Most notable is the fact that the IPE-15 thermoset film exhibits outstanding stress–strain behavior, i.e. elongation at break (∼17%) and toughness (766 MJ·m−3).

中文翻译：

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反应性侧基共聚酰胺半结晶聚（十亚甲基对苯二甲酰胺）热固性材料的合成及性能

摘要 我们使用活性侧基官能化共聚酰胺作为前体制备了半结晶聚酰胺 (PA) 热固性材料。使用低温溶液聚合方法合成了反应性间位和对位苯乙炔基二酰氯（IPE 和 TPE）并将其掺入聚（十亚甲基对苯二甲酰胺）（PA 10T）中。基于苯乙炔基的共聚单体会破坏最终共聚酰胺的结晶并降低熔化的开始。含有 5、10 和 15 mol% 反应性共聚单体的共聚酰胺可以在 350 °C 下固化成独立的 PA 热固性薄膜。正如 DMTA 所证实的，所有热固性薄膜在高达 400 °C 的温度下都是稳定的，这是网络形成的结果。热固性材料表现出结晶相和交联的无定形相。取决于侧基的浓度，与 PA 10T 参考聚合物相比，最终热固性塑料的结晶度可以控制和抑制 52-76%。最值得注意的是 IPE-15 热固性薄膜表现出出色的应力应变行为，即断裂伸长率 (~17%) 和韧性 (766 MJ·m-3)。