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Wetting and solidification of silver alloys in the presence of tungsten carbide
Acta Materialia ( IF 9.4 ) Pub Date : 2018-02-01 , DOI: 10.1016/j.actamat.2017.11.012
Nachiketa Ray , Ludo Froyen , Kim Vanmeensel , Jef Vleugels

Abstract The wettability of pure Ag and Ag alloys (with Ni and Cu) on WC was investigated as a function of temperature by means of sessile drop experiments. Ni was found to preferentially segregate at the Ag/WC interface resulting in a decreased contact angle as compared to Cu. The influence of the Ni content and WC particle size on the solidification behavior of Ag in infiltrated Ag-WC-Ni (40 wt% WC and 0.07/5 wt% Ni) composites was assessed, revealing the pushing of WC particles by the solidification front, especially in the materials with a finer WC particle size. Addition of Ni decreased the grain size of the Ag phase by promoting heterogeneous nucleation. Complete coherency between the Ag and Ni phases was confirmed by electron backscattered diffraction analysis.

中文翻译:

在碳化钨存在下银合金的润湿和凝固

摘要 通过静滴实验研究了纯银和银合金(含镍和铜)在 WC 上的润湿性与温度的关系。发现 Ni 优先在 Ag/WC 界面偏析,导致与 Cu 相比接触角减小。评估了 Ni 含量和 WC 粒径对 Ag-WC-Ni(40 wt% WC 和 0.07/5 wt% Ni)复合材料中 Ag 凝固行为的影响,揭示了凝固前沿对 WC 颗粒的推动,尤其是在WC粒度更细的材料中。Ni的添加通过促进异质成核降低了Ag相的晶粒尺寸。通过电子背散射衍射分析证实了 Ag 和 Ni 相之间的完全相干性。
更新日期:2018-02-01
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