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Twin-interface interactions in nanostructured Cu/Ag: Molecular dynamics study
Acta Materialia ( IF 8.3 ) Pub Date : 2018-02-01 , DOI: 10.1016/j.actamat.2017.10.036
R. Béjaud , J. Durinck , S. Brochard

Abstract The interaction of deformation twins with interfaces in nanostructured Cu/Ag is studied using molecular dynamics simulations. The influence of the interface structure on twin nucleation, propagation and thickening is analysed, and the role of the misfit interfacial dislocations mesh is detailed. In particular, we show that the interface can induce, directly or indirectly via Lomer dislocations, the nucleation of twinning dislocations. A thorough description of the involved mechanisms is given. Through this atomic scale approach, our study offers some useful understanding of the mechanical twinning process in nanolamellar composites, where twinning appears to be a common plasticity mechanism.

中文翻译:

纳米结构 Cu/Ag 中的双界面相互作用:分子动力学研究

摘要 利用分子动力学模拟研究了变形孪晶与纳米结构 Cu/Ag 界面的相互作用。分析了界面结构对孪晶形核、扩展和增厚的影响,并详细说明了失配界面位错网格的作用。特别是,我们表明界面可以通过 Lomer 位错直接或间接诱导孪晶位错的成核。给出了所涉及机制的详尽描述。通过这种原子尺度的方法,我们的研究为纳米层状复合材料中的机械孪生过程提供了一些有用的理解,其中孪生似乎是一种常见的塑性机制。
更新日期:2018-02-01
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