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Lithium tantalate photonic integrated circuits for volume manufacturing
Nature ( IF 64.8 ) Pub Date : 2024-05-08 , DOI: 10.1038/s41586-024-07369-1
Chengli Wang , Zihan Li , Johann Riemensberger , Grigory Lihachev , Mikhail Churaev , Wil Kao , Xinru Ji , Junyin Zhang , Terence Blesin , Alisa Davydova , Yang Chen , Kai Huang , Xi Wang , Xin Ou , Tobias J. Kippenberg

Electro-optical photonic integrated circuits (PICs) based on lithium niobate (LiNbO3) have demonstrated the vast capabilities of materials with a high Pockels coefficient1,2. They enable linear and high-speed modulators operating at complementary metal–oxide–semiconductor voltage levels3 to be used in applications including data-centre communications4, high-performance computing and photonic accelerators for AI5. However, industrial use of this technology is hindered by the high cost per wafer and the limited wafer size. The high cost results from the lack of existing high-volume applications in other domains of the sort that accelerated the adoption of silicon-on-insulator (SOI) photonics, which was driven by vast investment in microelectronics. Here we report low-loss PICs made of lithium tantalate (LiTaO3), a material that has already been adopted commercially for 5G radiofrequency filters6 and therefore enables scalable manufacturing at low cost, and it has equal, and in some cases superior, properties to LiNbO3. We show that LiTaO3 can be etched to create low-loss (5.6 dB m−1) PICs using a deep ultraviolet (DUV) stepper-based manufacturing process7. We demonstrate a LiTaO3 Mach–Zehnder modulator (MZM) with a half-wave voltage–length product of 1.9 V cm and an electro-optic bandwidth of up to 40 GHz. In comparison with LiNbO3, LiTaO3 exhibits a much lower birefringence, enabling high-density circuits and broadband operation over all telecommunication bands. Moreover, the platform supports the generation of soliton microcombs. Our work paves the way for the scalable manufacture of low-cost and large-volume next-generation electro-optical PICs.



中文翻译:

用于批量制造的钽酸锂光子集成电路

基于铌酸锂 (LiNbO 3 )的电光光子集成电路 (PIC)已经证明了具有高普克尔斯系数1,2的材料的巨大功能。它们使在互补金属氧化物半导体电压电平3下运行的线性高速调制器能够用于数据中心通信4、高性能计算和人工智能光子加速器5等应用。然而,该技术的工业应用受到每片晶圆成本高和晶圆尺寸有限的阻碍。高成本是由于其他领域缺乏现有的大批量应用而加速了绝缘体上硅(SOI)光子学的采用,而这是由微电子领域的巨额投资推动的。在这里,我们报告了由钽酸锂 (LiTaO 3 )制成的低损耗 PIC ,这种材料已在商业上用于 5G 射频滤波器6,因此能够以低成本进行可扩展制造,并且它具有相同的、在某些情况下甚至更优越的特性至LiNbO 3。我们表明,可以使用基于深紫外 (DUV) 步进机的制造工艺蚀刻 LiTaO 3以创建低损耗 (5.6 dB m -1 ) PIC 7。我们展示了 LiTaO 3 Mach-Zehnder 调制器 (MZM),其半波电压长度积为 1.9 V cm,电光带宽高达 40 GHz。与LiNbO 3相比,LiTaO 3表现出低得多的双折射率,从而能够在所有电信频段上实现高密度电路和宽带操作。此外,该平台支持孤子微梳的生成。我们的工作为低成本、大批量下一代光电 PIC 的可扩展制造铺平了道路。

更新日期:2024-05-08
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