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Restoration Temperature Control through Glass Transition Temperature Modulation of Shape Memory Polymer for Thermally Switchable Adhesive
Advanced Science ( IF 15.1 ) Pub Date : 2024-05-05 , DOI: 10.1002/advs.202309393
Han Jun Park 1 , Minsu Kim 1 , Jihoon Lee 1 , Moon Kyu Kwak 1
Affiliation  

Shape memory polymers (SMPs) undergo changes between arbitrary shapes and programmed shapes upon exposure to specific stimulus, allowing them to restore their original shape. All kinds of external stimuli have a threshold to change the shape of the SMP. Especially, for the thermal type SMP, the critical temperature for shape restoration is typically near the glass transition temperature (Tg). In this study, the controllability of the restoration temperature is analyzed by adjusting the Tg of the polymer using Norland Optical Adhesive 63, which can be cured with UV irradiation. By varying the ambient temperature from 20 to 120 °C during UV exposure, Tg changes ranging from 35.84 to 50.50 °C are obtained, with corresponding changes in restoration temperature. As a practical application, a thermal‐activated SMP dry adhesive is developed with programmable Tg and switchable adhesion. The fabricated SMP dry adhesive exhibited strong adhesion to substrates with various surface roughness. Additionally, the shape memory effect allowed for easy detachment through shape recovery, and different adhesive performances at different temperatures are achieved by programming various Tg values. Moreover, the simple manufacturing process of the SMP dry adhesive is confirmed to be suitable for continuous fabrication processes based on roll‐to‐roll methods.

中文翻译:

通过调节热切换粘合剂形状记忆聚合物的玻璃化转变温度来控制恢复温度

形状记忆聚合物(SMP)在受到特定刺激时会在任意形状和编程形状之间发生变化,从而使它们能够恢复原始形状。各种外部刺激都有一个阈值来改变SMP的形状。特别是对于热型SMP,形状恢复的临界温度通常接近玻璃化转变温度(时间G)。本研究通过调整恢复温度的可控性进行了分析时间G使用 Norland Optical Adhesive 63 进行聚合物的改性,可通过紫外线照射进行固化。通过在紫外线照射期间将环境温度从 20°C 变化到 120°C,时间G获得了从 35.84 到 50.50 °C 的变化,以及恢复温度的相应变化。作为实际应用,我们开发了一种具有可编程功能的热激活 SMP 干胶时间G和可切换的粘合力。所制备的 SMP 干粘合剂对各种表面粗糙度的基材表现出很强的粘合力。此外,形状记忆效应允许通过形状恢复轻松分离,并且通过对不同的编程实现不同温度下的不同粘合性能。时间G价值观。此外,SMP干胶的简单制造工艺被证实适合基于卷对卷方法的连续制造工艺。
更新日期:2024-05-05
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