A series of quaternary ammonium salt derivatives based on 1-phenylazo-2-naphthol (Sudan I) have been synthesized and showed novel ability in inhibiting copper electrodeposition as efficient levelers. The electrochemical test, theoretical calculation and molecular dynamics simulation were presented, and Sudan-QNL exhibited the best ability to adsorb electrode and promote polarization. The microscopy and X-ray diffractions showed that Sudan-QNL can significantly improve the flatness and filling of copper electrodeposition in the printed circuit board (PCB) through hole. Through the observation of copper layer by electron backscatter diffractometer (EBSD) and X-ray diffractometer (XRD), it was found that the addition of additives can significantly refine the grain size and obtain a smooth deposited copper layer with high preferred orientation of the crystal plane. In addition, the high electrostatic adsorption of levelers and its strong binding ability to copper ions and thus affecting the ion diffusion rate may be the fundamental reasons for its role.

中文翻译：

---

基于影响离子扩散策略的苏丹Ⅰ型铜电沉积整平剂的合成及机理研究


合成了一系列基于1-苯基偶氮-2-萘酚（Sudan I）的季铵盐衍生物，并显示出作为有效整平剂抑制铜电沉积的新能力。电化学测试、理论计算和分子动力学模拟表明，Sudan-QNL表现出最佳的吸附电极和促进极化的能力。显微镜和X射线衍射表明Sudan-QNL可以显着改善印刷电路板（PCB）通孔中电沉积铜的平整度和填充性。通过电子背散射衍射仪（EBSD）和X射线衍射仪（XRD）对铜层的观察发现，添加剂的加入可以显着细化晶粒尺寸，获得光滑且具有高晶体择优取向的沉积铜层。飞机。此外，整平剂的高静电吸附性及其与铜离子的强结合能力从而影响离子扩散速率可能是其发挥作用的根本原因。