This paper proposed a new heat dissipation structure called double-layer triangular micro-channel (DLTMC) to solve the increasingly serious thermal problem of three-dimensional integrated circuits (3D-ICs). The matrix equation of heat transmission is established to derive steady-state temperature of 3D-ICs with embedded DLTMC, which is based on equivalent thermal resistance network. According to proposed computation thermal model, the heat transfer performances of 3D-ICs with embedded DLTMC concerning different cooling liquids are investigated, where the impacts of different bottom angle of DLTMC, volume concentration of nanofluid and flow velocity of cooling liquid are considered. The results show that the proposed DLTMC structure can significantly reduce steady-state temperature compared with conventional structure of single layer rectangular micro-channel (SLRMC), the corresponding steady-state temperature for them can be reduced over 32.098 %. Besides, it is demonstrated that the steady-state temperature for MWCNT-water and SWCNT-water nanofluids as cooling liquids can be reduced by 22.490 % and 19.801 % than conventional water case, respectively. Moreover, it is manifested that the increase of bottom angle of DLTMC, volume concentration of nanofluid and flow velocity of cooling liquid can evidently improve heat transfer performance of 3D-ICs. Therefore, the presented results in this paper are beneficial for solving complex thermal problems of 3D-ICs.

中文翻译：

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三维集成电路中双层三角形微通道的集成增强传热性能

本文提出了一种称为双层三角微通道（DLTMC）的新型散热结构，以解决三维集成电路（3D-IC）日益严重的散热问题。基于等效热阻网络，建立了传热矩阵方程，推导了嵌入 DLTMC 的 3D-IC 的稳态温度。根据提出的计算热模型，研究了嵌入DLTMC的3D-IC对于不同冷却液的传热性能，其中考虑了不同DLTMC底角、纳米流体体积浓度和冷却液流速的影响。结果表明，与传统的单层矩形微通道结构（SLRMC）相比，所提出的DLTMC结构可以显着降低稳态温度，相应的稳态温度可以降低32.098%以上。此外，结果表明，多壁碳纳米管-水和单壁碳纳米管-水纳米流体作为冷却液的稳态温度可分别比传统水的情况降低22.490%和19.801%。此外，结果表明，增加DLTMC的底角、纳米流体的体积浓度和冷却液的流速可以明显改善3D-IC的传热性能。因此，本文提出的结果有利于解决 3D-IC 的复杂热问题。