Taking inspiration from the unique hierarchical structure of bio-materials like pearl oyster, this study employs bio-inspired composites technological route using flake powder metallurgy to prepare laminated Cu/TiSiC/C composites. The prepared composites have clear laminated structure, uniform dispersion of reinforcing phase and clean interface. At a Cu-plated GNPs content of 0.5 wt%, the composites displayed tensile strength of 300.65 MPa, compressive strength of 575.32 MPa, electrical conductivity of 26.31 MS/m, and thermal conductivity of 285.87 W·m·K. The reinforcement of composites is caused by the load transfer effect of the laminated structure. During the loading process, the laminated structure creates multiple paths for deflecting cracks, which leads to the redistribution of the applied load. Moreover, the homogeneous distribution of GNPs throughout the laminated structure extends the mean free path of both free electrons and phonons within the material, consequently bolstering the electrical and thermal conductivity of the composites.

中文翻译：

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石墨烯纳米片增强仿生层压 Cu/Ti3SiC2/C 复合材料的电热性能

受珍珠贝等生物材料独特的分级结构的启发，本研究采用仿生复合材料技术路线，利用片状粉末冶金制备层状Cu/TiSiC/C复合材料。所制备的复合材料具有清晰的层状结构、增强相分散均匀、界面洁净。当镀铜GNPs含量为0.5 wt%时，复合材料的拉伸强度为300.65 MPa，压缩强度为575.32 MPa，电导率为26.31 MS/m，导热率为285.87 W·m·K。复合材料的增强是由层合结构的载荷传递效应引起的。在加载过程中，层合结构会产生多个偏转裂纹的路径，从而导致所施加载荷的重新分布。此外，GNP 在整个层压结构中的均匀分布延长了材料内自由电子和声子的平均自由程，从而增强了复合材料的导电性和导热性。