As electronic devices continue to develop towards miniaturization and high integration. Microchannel heat sinks (MCHSs) have received widespread attention in the heat dissipation of high heat flux electronic devices due to their large surface-to-volume ratio, compact structure, and excellent thermal performance. The limited heat transfer capacity of traditional microchannel heat sinks, high-temperature gradients along the flow direction, and the generation of local hot spots have become major challenges for the efficient operation and longevity of electronic components. In response to these issues, researchers have been working to design and improve microchannel heat sinks in recent years. Therefore, this article summarizes the heat transfer and flow characteristics of various enhanced structures of single-phase flow microchannel heat sinks, providing direction for exploring high heat transfer capacity and low-pressure drop loss combination structures. In addition, it summarizes methods for hot spot management and reducing temperature distribution unevenness in single-phase flow microchannel heat sinks. Finally, reasonable suggestions are made for future research directions and ideas for microchannel heat sinks.

中文翻译：

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微型散热器对电子设备的被动增强传热、热点管理和温度均匀性增强：综述

随着电子设备不断向小型化、高集成化方向发展。微通道散热器（MCHS）因其较大的表面积与体积比、紧凑的结构和优异的热性能而在高热通量电子器件的散热中受到广泛关注。传统微通道散热器传热能力有限、沿流动方向的高温梯度以及局部热点的产生已成为电子元件高效运行和寿命的主要挑战。针对这些问题，研究人员近年来一直致力于设计和改进微通道散热器。因此，本文总结了单相流微通道散热器各种增强结构的传热和流动特性，为探索高传热能力和低压降损失的组合结构提供方向。此外，还总结了单相流微通道散热器中热点管理和减少温度分布不均匀的方法。最后，对微通道散热器未来的研究方向和思路提出了合理的建议。