The size and grain conformality of the metallurgical precursor powder significantly affect the comprehensive properties of metal matrix composites. To address this challenge, homogeneous hybrids of graphene-like nanosheets coated Cu (GLNs@Cu) particles with controllable sizes are synthesized through an in-situ decomposition of cupric tartrate. Subsequently, graphene-like nanosheet network reinforced Cu (GLNN/Cu) composites are prepared by a powder-metallurgical method from the GLNs@Cu particles based on a thermal-pressing welding mechanism. The 3D-GLNN are uniformly dispersed throughout the Cu matrix, creating an isolation structure over the Cu grains, and acting as a barrier to grain fusion resulting in grain conformality of the composites. Simultaneously, the 3D-GLNN distributes along the Cu grain boundaries establishing inter-connected pathways for the electrons, thereby maintaining high electrical conductivity while refining the grain size of the Cu composites. It is precisely because of this, the GLNN/Cu composites exhibit a tensile strength of ∼500 MPa, approximately 3 times higher than that of the pure Cu. In addition, the interlinked 3D-GLNN provides an electron transport channel for the Cu composite as well as an isolation structure from the corrosive medium, which makes the Cu composite maintain an electrical conductivity even higher than the pure Cu and a corrosion rate of 48.9 % compared with the pure Cu.

中文翻译：

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类石墨烯纳米片网络增强铜复合材料的粉末冶金结构，实现平衡的高性能

冶金前驱体粉末的尺寸和晶粒共形性显着影响金属基复合材料的综合性能。为了应对这一挑战，通过酒石酸铜的原位分解合成了尺寸可控的类石墨烯纳米片涂覆的铜（GLNs@Cu）颗粒的均质杂化物。随后，基于热压焊接机制，通过粉末冶金方法由 GLNs@Cu 颗粒制备了类石墨烯纳米片网络增强铜 (GLNN/Cu) 复合材料。 3D-GLNN 均匀地分散在整个 Cu 基体中，在 Cu 晶粒上形成隔离结构，并充当晶粒融合的屏障，从而实现复合材料的晶粒共形性。同时，3D-GLNN 沿着 ​​Cu 晶界分布，为电子建立互连路径，从而保持高导电性，同时细化 Cu 复合材料的晶粒尺寸。正是因为如此，GLNN/Cu复合材料的拉伸强度达到~500 MPa，大约是纯Cu的3倍。此外，互连的3D-GLNN为Cu复合材料提供了电子传输通道以及与腐蚀介质的隔离结构，这使得Cu复合材料保持了比纯Cu更高的导电率和48.9%的腐蚀率与纯铜相比。