An experimental and numerical investigation to assess the impact of the number of fin arrangements on heat dissipation and its subsequent influence on junction temperature under natural convection. The experimental phase incorporated a thermal pad with a thermal conductivity of 12 and an aluminum heat spreader measuring (17x16.5) mm. By utilizing the finite volume method (FVM), a numerical model was developed that closely resembles the experimental setup, with errors for temperature package and heat spreader measured at 0.08% and 4.49%, respectively. The analysis was carried out for five different numbers of fins, specifically , , , and . According to the numerical analysis, the increase in the number of fins from 4 to 12 led to a reduction in the average junction temperature from 79.11 °C to 75.97 °C. This denotes a decrease of 3.97% in the average junction temperature. The inclusion of fins on the heat spreader brought about an upsurge in conduction resistance from 55.77 °C/W to 56.19 °C/W, while the convective resistance observed a decline from 152.35 °C/W to 139.62 °C/W. By increasing the number of fins from 4 to 12, the Nusselt number experiences a monotonic decrease from 14.44 to 14.141 due to the reduction in fin-to-fin spacing. As a result, this would lead to a decrease in the natural convection flow. Hence, it was concluded that increasing number of fins beyond the optimal number of fins, signifying the point where thermal benefits become insignificant. The results of this study yield significant insights into the optimization and design of thermal solutions for semiconductor modules, ultimately providing a pathway to boost their operational efficiency and longevity in real-world applications.

中文翻译：

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带导热垫的散热器不同配置的半导体模块功耗性能

一项实验和数值研究，旨在评估翅片排列数量对散热的影响及其对自然对流下结温的影响。实验阶段采用了导热率为 12 的导热垫和尺寸为 (17x16.5) mm 的铝制散热器。通过利用有限体积法 (FVM)，开发了一个与实验设置非常相似的数值模型，温度包和散热器的测量误差分别为 0.08% 和 4.49%。对五种不同数量的翅片进行了分析，具体为 、 、 和 。根据数值分析，鳍片数量从4个增加到12个导致平均结温从79.11℃降低到75.97℃。这意味着平均结温降低了 3.97%。散热器上添加翅片后，传导电阻从 55.77 °C/W 上升至 56.19 °C/W，而对流电阻则从 152.35 °C/W 下降至 139.62 °C/W。通过将翅片数量从 4 个增加到 12 个，由于翅片间间距的减小，努塞尔数从 14.44 单调减少到 14.141。结果，这将导致自然对流减少。因此，得出的结论是，增加翅片数量超过最佳翅片数量，表明热效益变得不显着。这项研究的结果为半导体模块热解决方案的优化和设计提供了重要的见解，最终提供了提高其在实际应用中的运行效率和寿命的途径。