The silver migration limits the application of silver based conductive adhesives in wet environment. The existing methods for inhibiting silver migration in epoxy conductive silver adhesives involve one or more issues such as cost, complexity, and inhibition of conductivity. Moreover, there is currently a lack of strategies that can suppress the silver migration effect while ensuring good dispersion of silver fillers in the matrix and constructing a good filler matrix interface. Herein, a facile method was reported suppressing the silver migration in silver-epoxy conductive adhesive. Tetrafunctional thiopentaerythritol tetramercaptoacetate (PERTMA) was introduced into 1,4-cyclohexanedimethanol diglycidyl ether (CHDMGE) epoxy resin as the curing agent. This method utilized the strong interaction between silver and thiols, including coordination and covalent bonding, to achieve good compatibility between filler and matrix. By tightly combining silver with the resin system, the content of free silver atoms was reduced, capturing and inhibiting the hydrolysis of silver atoms and their migration with current, and the conductivity of the conductive silver adhesive was not greatly degraded due to the silver-thiol interaction. At the same time, the introducing of PERTMA was able to reduce the surface hydrophilicity of epoxy resin, which also helped suppressing the silver migration effect under humid circumstances. The interaction between silver and thiol was characterized, and the influence of silver content on the curing behavior, material mechanical performance, conductivity, resistivity on silver migration and flexibility was explored. The CHDMGE/PERTMA/Ag conductive adhesive based on strong thiol-silver interaction had excellent resistance to silver migration, which occurred after 3500s, which was 10.67 times longer than the control group. In addition, the silver filler enhanced the tensile strength of the matrix resin by this thiol-silver interaction. This study will provide new ideas for the design and development of silver migration resistant conductive adhesives based on matrix filler interaction.

中文翻译：

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基于硫醇-银相互作用的抑制银迁移率的银-环氧树脂粘合剂的构建

银的迁移限制了银基导电胶在潮湿环境中的应用。现有的抑制环氧导电银粘合剂中银迁移的方法涉及一个或多个问题，例如成本、复杂性和抑制导电性。而且，目前缺乏能够抑制银迁移效应，同时保证银填料在基体中良好分散并构建良好的填料基体界面的策略。本文报道了一种抑制银环氧导电粘合剂中银迁移的简便方法。将四官能硫代季戊四醇四巯基乙酸酯（PERTMA）作为固化剂引入到1,4-环己烷二甲醇二缩水甘油醚（CHDMGE）环氧树脂中。该方法利用银和硫醇之间的强相互作用，包括配位和共价键，以实现填料和基体之间良好的相容性。通过银与树脂体系的紧密结合，降低了游离银原子的含量，捕获并抑制了银原子的水解及其随电流的迁移，并且导电银胶的导电性不会因银硫醇而大幅降低。相互作用。同时，PERTMA的引入能够降低环氧树脂的表面亲水性，这也有助于抑制潮湿环境下的银迁移效应。表征了银与硫醇之间的相互作用，探讨了银含量对固化行为、材料机械性能、导电性、电阻率对银迁移和柔韧性的影响。基于强硫醇-银相互作用的CHDMGE/PERTMA/Ag导电胶具有优异的抗银迁移能力，在3500s后发生银迁移，比对照组长10.67倍。此外，银填料通过硫醇-银相互作用增强了基体树脂的拉伸强度。该研究将为基于基体填料相互作用的抗银迁移导电胶的设计和开发提供新思路。