Polytetrafluoroethylene (PTFE)/boron nitride (BN) composites has ultra-low dielectric loss and thermal conductivity, making it a suitable choice for high-frequency communication copper-clad laminate. However, the low peel strengthens of these composites restricted the further application, due to the low polarity and smooth surface of BN. Here, we assemble liquid metal (LM) on BN filler (LM-BN) via a mechanochemistry method. The surface polarity and roughness of BN can be enhanced by the oxidized layer from LM. The thermal interfacial overlap between BN sheets can be enhanced by LM droplets. Consequently, at filler content of 50 vol%, the thermal conductivity increases from 0.3 W/m⋅K of PTFE to 1.90 W/m⋅K for PTFE/BN composites, to 2.05 W/m⋅K for PTFE/LM-BN composites, and the peel strength exhibit a nearly 100% increment from 0.19 of PTFE/BN to 0.39 N/mm of PTFE/LM-BN. Along with low dielectric loss, excellent thermal conductivity, peel strength, and reduced thermal expansion, this method ensures a wider application of PTFE/LM-BN composites in electronic packaging.

中文翻译：

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用于聚四氟乙烯复合材料的液态金属改性氮化硼具有增强的导热性和剥离强度

聚四氟乙烯（PTFE）/氮化硼（BN）复合材料具有超低介电损耗和导热系数，使其成为高频通信覆铜板的合适选择。然而，由于BN的低极性和光滑的表面，这些复合材料的低剥离强度限制了进一步的应用。在这里，我们通过机械化学方法在氮化硼填料（LM-BN）上组装液态金属（LM）。 LM 的氧化层可以增强 BN 的表面极性和粗糙度。 LM 液滴可以增强 BN 片材之间的热界面重叠。因此，当填料含量为 50 vol% 时，导热系数从 PTFE 的 0.3 W/m·K 增加到 PTFE/BN 复合材料的 1.90 W/m·K，再增加到 PTFE/LM-BN 复合材料的 2.05 W/m·K ，剥离强度从 PTFE/BN 的 0.19 N/mm 增加到 PTFE/LM-BN 的 0.39 N/mm，几乎增加了 100%。该方法具有低介电损耗、优异的导热性、剥离强度和降低的热膨胀性，确保了 PTFE/LM-BN 复合材料在电子封装中的更广泛应用。