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Impact of BGA Package Failure on Crosstalk in Microwave Circuits Using GSG Structure
IEEE Transactions on Electromagnetic Compatibility ( IF 2.1 ) Pub Date : 2024-03-19 , DOI: 10.1109/temc.2024.3372659 Kaixuan Song 1 , Jinchun Gao 1 , Ziren Wang 2 , Chaoyi Wang 1 , Rui Ji 3 , Hafiz Muhammad Bilal 1
中文翻译：
BGA 封装失效对采用 GSG 结构的微波电路串扰的影响
更新日期：2024-03-19
IEEE Transactions on Electromagnetic Compatibility ( IF 2.1 ) Pub Date : 2024-03-19 , DOI: 10.1109/temc.2024.3372659 Kaixuan Song 1 , Jinchun Gao 1 , Ziren Wang 2 , Chaoyi Wang 1 , Rui Ji 3 , Hafiz Muhammad Bilal 1
Affiliation
中文翻译：
BGA 封装失效对采用 GSG 结构的微波电路串扰的影响
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