当前位置: X-MOL 学术IEEE Trans. Electromagn Compat. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
A Segmentation Approach for Predicting Plane Wave Coupling to PCB Structures
IEEE Transactions on Electromagnetic Compatibility ( IF 2.1 ) Pub Date : 2024-01-17 , DOI: 10.1109/temc.2024.3349911
Shengxuan Xia 1 , James Hunter 1 , Aaron Harmon 1 , Ahmed M. Hassan 2 , Victor Khilkevich 1 , Daryl G. Beetner 1
Affiliation  

Evaluating the far-field radio frequency (RF) susceptibility of electronic devices often depends on extensive testing or full wave simulations. These methods are effective when complete system information is available but require substantial time and resources to evaluate a large number of variations in system configurations, where trace routings, integrated circuit (IC) package styles, trace terminations, arrival angle, and polarization of incoming wave, etc., are varied from one configuration to another. The goal of the following article is to develop simulation techniques for studying the statistical characteristics of coupling to typical printed circuit board (PCB) structures. Simulation time can be reduced by breaking the structure into small segments, determining the coupling and transmission characteristics of each segment analytically or in a full-wave model, and then determining the coupling to the overall structure by assembling the individual segments in a circuit simulation. Reusing premodeled segments of commonly occurring structures (e.g., IC package, trace, etc.) allows one to make estimates with minimal computational effort even for a complicated PCB design. Simulation time is estimated to improve by a factor of 40 or more over traditional full-wave modeling using this approach. This methodology enables the analysis of statistical electromagnetic coupling to random PCB geometries.

中文翻译:

预测 PCB 结构平面波耦合的分段方法

评估电子设备的远场射频 (RF) 敏感性通常取决于广泛的测试或全波模拟。当完整的系统信息可用时,这些方法是有效的,但需要大量的时间和资源来评估系统配置中的大量变化,其中走线布线、集成电路 (IC) 封装样式、走线终端、到达角和入射波的偏振等,从一种配置到另一种配置是不同的。下一篇文章的目标是开发仿真技术来研究典型印刷电路板 (PCB) 结构耦合的统计特性。通过将结构分成小段,通过分析或在全波模型中确定每个段的耦合和传输特性,然后通过在电路仿真中组装各个段来确定与整体结构的耦合,可以减少仿真时间。重复使用常见结构(例如 IC 封装、迹线等)的预建模片段,即使对于复杂的 PCB 设计,也可以用最少的计算量进行估计。使用这种方法,仿真时间预计比传统全波建模缩短 40 倍或更多。该方法能够分析随机 PCB 几何形状的统计电磁耦合。
更新日期:2024-01-17
down
wechat
bug