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A two-dimensional lead-free hybrid perovskite semiconductor with reduced melting temperature
Chemical Communications ( IF 4.3 ) Pub Date : 2023-06-09 , DOI: 10.1039/d3cc01788e Akash Singh 1, 2 , Ethan Crace 1 , Yi Xie 1, 2 , David B Mitzi 1, 3
Chemical Communications ( IF 4.3 ) Pub Date : 2023-06-09 , DOI: 10.1039/d3cc01788e Akash Singh 1, 2 , Ethan Crace 1 , Yi Xie 1, 2 , David B Mitzi 1, 3
Affiliation
1-Methylhexylammonium tin iodide yields the lowest reported melting temperature (Tm = 142 °C) to date among lead-free hybrid perovskite semiconductors. Molecular branching near the organic ammonium group coupled with tuning of metal/halogen character suppresses Tm and facilitates effective melt-based deposition of films with 568 nm absorption onset.
中文翻译:
一种降低熔化温度的二维无铅杂化钙钛矿半导体
1-甲基己基碘化锡锡在无铅混合钙钛矿半导体中具有迄今为止报道的最低熔化温度(T m = 142 °C)。有机铵基团附近的分子支化与金属/卤素特性的调节相结合可抑制T m并促进具有 568 nm 吸收起始的薄膜的有效熔体沉积。
更新日期:2023-06-09
中文翻译:
一种降低熔化温度的二维无铅杂化钙钛矿半导体
1-甲基己基碘化锡锡在无铅混合钙钛矿半导体中具有迄今为止报道的最低熔化温度(T m = 142 °C)。有机铵基团附近的分子支化与金属/卤素特性的调节相结合可抑制T m并促进具有 568 nm 吸收起始的薄膜的有效熔体沉积。