Intermetallic compounds (ICs) have been actively investigated since the early twentieth century due to their high strength, especially at high temperatures, as well as a variety of other complex features. However, lack of ductility at ambient temperature has continually hampered their practical applications. In recent years, the concept of entropy stabilization in multicomponent materials or high entropy materials (HEMs) has revolutionized the design of various materials including disordered solid solution alloys, ordered ceramics, and ICs. Ordered high entropy ICs (HEICs) are one type of these materials, which incorporate the benefits of HEMs and ICs into a singular material. HEICs exhibit a long-range ordered structure and well-defined multicomponent compositions with complex sublattice occupancy. This could open up a new avenue for tackling the long-standing brittleness of ICs at low temperatures. This review article aims to provide a comprehensive overview of the present state of design and unique features of HEICs. We classify nearly all developed multicomponent ICs based on ordering types and focus on microstructural features in these HEICs, such as ordered superlattice structure, nanoscale multi-element segregation, and tailoring disorder degree. These characteristics may result in improved mechanical and functional properties. Finally, we summarize the current state and future prospects of material design challenges and opportunities in ordered multicomponent alloys.

自二十世纪初以来，金属间化合物 (IC) 因其高强度（尤其是在高温下）以及各种其他复杂特性而受到积极研究。然而，在环境温度下缺乏延展性一直阻碍着它们的实际应用。近年来，多组分材料或高熵材料 (HEM) 中熵稳定的概念彻底改变了各种材料的设计，包括无序固溶体合金、有序陶瓷和 IC。有序高熵 IC (HEIC) 是这些材料的一种，它将 HEM 和 IC 的优点结合到单一材料中。HEIC 表现出长程有序结构和定义明确的多组分组成，具有复杂的亚晶格占有率。这可能为解决 IC 在低温下长期存在的脆性问题开辟一条新途径。这篇评论文章旨在全面概述 HEIC 的设计现状和独特功能。我们根据有序类型对几乎所有开发的多组件 IC 进行分类，并关注这些 HEIC 的微观结构特征，例如有序超晶格结构、纳米级多元素偏析和剪裁无序度。这些特性可能导致改进的机械和功能特性。最后，我们总结了有序多组分合金材料设计挑战和机遇的现状和未来前景。这篇评论文章旨在全面概述 HEIC 的设计现状和独特功能。我们根据有序类型对几乎所有开发的多组件 IC 进行分类，并关注这些 HEIC 的微观结构特征，例如有序超晶格结构、纳米级多元素偏析和剪裁无序度。这些特性可能导致改进的机械和功能特性。最后，我们总结了有序多组分合金材料设计挑战和机遇的现状和未来前景。这篇评论文章旨在全面概述 HEIC 的设计现状和独特功能。我们根据有序类型对几乎所有开发的多组件 IC 进行分类，并关注这些 HEIC 的微观结构特征，例如有序超晶格结构、纳米级多元素偏析和剪裁无序度。这些特性可能导致改进的机械和功能特性。最后，我们总结了有序多组分合金材料设计挑战和机遇的现状和未来前景。这些特性可能导致改进的机械和功能特性。最后，我们总结了有序多组分合金材料设计挑战和机遇的现状和未来前景。这些特性可能导致改进的机械和功能特性。最后，我们总结了有序多组分合金材料设计挑战和机遇的现状和未来前景。