The effects of stress and strain on the superconducting transition behavior of electrodeposited Re film are investigated using sandwich structures, where a thin Re layer is deposited in between thicker metal layers with different coefficients of thermal expansion (CTE), such as Cr and Cu. The entire sandwich structures are prepared using electrodeposition at room temperature. Cyclic voltammetry is conducted to characterize the electrochemical behavior of metal deposition. X-ray fluorescence, scanning electron microscope, X-ray diffraction, electrical resistance measurements at cryogenic temperature, and in-situ X-ray diffraction are utilized to characterize the electrodeposited films in the stacks. The Re films sandwiched between metals with different CTEs show different superconducting transition and recrystallization behaviors. This study provides an innovative method to inhibit grain growth and to maintain an enhanced critical temperature of the electrodeposited amorphous superconducting Re.

使用夹层结构研究了应力和应变对电沉积 Re 薄膜超导转变行为的影响，其中薄 Re 层沉积在具有不同热膨胀系数 (CTE) 的较厚金属层（例如 Cr 和 Cu）之间。整个夹层结构是在室温下使用电沉积制备的。进行循环伏安法以表征金属沉积的电化学行为。X 射线荧光、扫描电子显微镜、X 射线衍射、低温下的电阻测量和原位 X 射线衍射用于表征堆栈中的电沉积薄膜。夹在具有不同 CTE 的金属之间的 Re 薄膜表现出不同的超导转变和再结晶行为。