Abstract The purpose of this paper is to investigate the microstructure and properties of Cu-W alloys induced by high-current pulsed electron beam (HCPEB) irradiation. The microstructural observation shows that craters were formed after 5 pulses of HCPEB irradiation. With the increasing numbers of pulses, these craters were further fused and eliminated, which results in an excellent surface finishing. In addition, the composition of melted layer was homogenized because of the inter-diffusion between Cu and W atoms. During the process of HCPEB irradiation, several modifications were formed, including Cu (W) solid solution, ultrafine grains, amorphous phase, and long-period superlattice phase, which significantly increased the microhardness of the surface. The results of sliding wear tests indicate that the HCPEB irradiated samples exhibited better properties as compared to that of the initial one, which was attributed to the ultrafine W particles embedded in the Cu matrix.

中文翻译：

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大电流脉冲电子束诱导Cu-W粉末冶金合金表面改性

摘要 本文旨在研究高电流脉冲电子束(HCPEB) 辐照诱导下Cu-W 合金的显微组织和性能。微观结构观察表明，在 5 次 HCPEB 照射后形成了陨石坑。随着脉冲数量的增加，这些凹坑被进一步融合和消除，从而产生了极好的表面光洁度。此外，由于 Cu 和 W 原子之间的相互扩散，熔化层的成分均匀化。在HCPEB辐照过程中，形成了Cu(W)固溶体、超细晶粒、非晶相和长周期超晶格相等多种变体，显着提高了表面的显微硬度。