Thermal management has become a serious problem with development of miniaturized, high integration and high performance electronics devices, where the improvement of thermal conductivity on polymer composites is crucial for the internal heat transfer and dissipation. In this work, graphene aerogels (GA) with three-dimensional (3D) structure were prepared by a simple method and reduced by different ways. Then, GA were used as fillers to prepare high thermal conductivity polymer composites. A thermal conductivity of 3.36 W m⁻¹ K⁻¹ at room temperature was obtained when use polyurethane filling the hydroiodic acid reduced GA composite (HI-RGA/PU), and the graphene loading was as low as 2.5 wt.%. This result is better than most researches of polymer-based thermal conductive composites. Furthermore, the heat transfer test and thermal cycling test show that HI-RGA/PU has a good and stable performance in the practical application as thermal interface material (TIM), which proves that GA is a promising filler for thermal conductive material.

随着小型化，高集成度和高​​性能电子设备的发展，热管理已成为一个严重的问题，其中聚合物复合材料导热系数的提高对于内部传热和散热至关重要。在这项工作中，通过简单的方法制备了具有三维（3D）结构的石墨烯气凝胶（GA），并通过不同的方法对其进行了还原。然后，将GA用作填料，以制备高导热率的聚合物复合材料。导热系数为3.36 W m ^-1  K ^-1当使用聚氨酯填充氢碘酸还原的GA复合材料（HI-RGA / PU）时，获得在室温下的室温，并且石墨烯负载低至2.5重量％。该结果优于大多数基于聚合物的导热复合材料的研究。此外，传热测试和热循环测试表明，HI-RGA / PU作为热界面材料（TIM）在实际应用中具有良好且稳定的性能，这证明GA是一种有前途的导热材料填料。