Extensible quantum computing architectures require a large array of quantum bits operating with low error rates. A quantum processor based on superconducting devices can be scaled up by stacking microchips that perform wiring, shielding, and computational functionalities. In this article, we demonstrate a vacuum thermocompression bonding technology that utilizes thin indium films as a welding agent to attach pairs of lithographically patterned chips. At 10 mK, we find a specific dc bond resistance of 49.2 μΩ cm2. We show good transmission up to 6.8 GHz in a tunnel-capped, bonded device as compared to a similar uncapped device. Finally, we fabricate and measure a set of tunnel-capped superconducting resonators, demonstrating that our bonding technology can be used in quantum computing applications.

中文翻译：

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多层超导量子电路的热压接技术

可扩展的量子计算架构需要大量以低错误率运行的量子位。基于超导器件的量子处理器可以通过堆叠执行布线、屏蔽和计算功能的微芯片来放大。在本文中，我们展示了一种真空热压接合技术，该技术利用铟薄膜作为焊接剂来连接成对的光刻图案芯片。在 10 mK 时，我们发现特定的直流键合电阻为 49.2 μΩ cm2。与类似的未封顶设备相比，我们在隧道封顶绑定设备中显示出高达 6.8 GHz 的良好传输。最后，我们制造并测量了一组隧道封端的超导谐振器，证明我们的键合技术可用于量子计算应用。