The influence of semiconductor morphology on the mechanical response of low voltage, flexible organic field‐effect transistors fabricated on plastic substrates is explored. Bar‐assisted meniscus shearing is considered for patterning the organic semiconductor; morphological features of the film are changed by varying the shearing direction. Several devices with two different organic semiconductor coatings are reported. The response of such devices to two kinds of deformation, namely elongation and compression, are investigated. The effect of mechanical stress is also considered. A detailed morphological analysis, including atomic force microscopy and scanning Kelvin probe microscopy, is performed in order to shine a light on the relationship between morphological features and electrical response of the devices. The results demonstrate that not only the response to bending is reliant on the morphological properties of the films but also that it can be tuned according to the bar‐shearing direction. The employment of the proposed approach for the development of devices with different extent of response to mechanical deformation, from bending sensors to strain‐insensitive devices for applications needing electrical stability upon deformation, can be thus foreseen.

中文翻译：

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形态对溶液处理半导体可弯曲有机场效应晶体管机械应力响应的影响

探索了半导体形态对在塑料衬底上制造的低压柔性有机场效应晶体管的机械响应的影响。考虑使用棒辅助的弯月面剪切来构图有机半导体。膜的形态特征通过改变剪切方向而改变。报道了几种具有两种不同有机半导体涂层的器件。研究了这种装置对两种变形的响应，即伸长和压缩。还考虑了机械应力的影响。进行了详细的形态分析，包括原子力显微镜和扫描开尔文探针显微镜，以阐明器件的形态特征与电响应之间的关系。结果表明，不仅弯曲响应取决于薄膜的形态特性，而且可以根据钢筋剪切方向进行调整。因此，可以预见到使用拟议的方法来开发对机械变形有不同程度响应的设备，从弯曲传感器到应变不敏感的设备，以适应需要变形时的电稳定性的应用。