Abstract With excellent performance in mechanical strength and hardness, low melting point solder alloys have been identified as a promising lead-free alternative for microelectronic industry. However, the application of such alloys is hindered because of the serious creep deformation when electronic devices are inevitably heated up during operation or even at room temperature. In this study, non-reactive Al 2 O 3 nano particles is explored as an option to enhance the creep resistance of eutectic SnBi alloy that has a melting temperature of 139 °C. Eutectic SnBi was mixed with nano Al 2 O 3 particles for up to 4 wt%. Nanoindentation testing protocol for the creep properties measurement is used in this study. Core diffusion controlled dislocation climb is found to be the creep mechanism for the composite alloy. Other mechanical properties including elastic modulus and hardness are also evaluated and related to the microstructure evolvement of the nanocomposite alloy at various filler loadings. This work also compares the effectiveness of non-reactive fillers with the reactive fillers on enhancing the creep resistance of SnBi alloy. Suitable filler candidates for the best mechanical performance of SnBi composite alloys are recommended.

中文翻译：

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使用非反应性纳米填料提高 SnBi 焊料合金的抗蠕变性：使用纳米压痕的研究

摘要 低熔点焊料合金具有优异的机械强度和硬度性能，被认为是微电子行业有前途的无铅替代品。然而，当电子设备在工作过程中甚至在室温下不可避免地发热时，由于其严重的蠕变变形，这种合金的应用受到了阻碍。在这项研究中，探索了非反应性 Al 2 O 3 纳米颗粒作为提高熔点为 139 °C 的共晶 SnBi 合金抗蠕变性的一种选择。共晶 SnBi 与纳米 Al 2 O 3 颗粒混合高达 4 wt%。本研究中使用了用于蠕变特性测量的纳米压痕测试协议。发现核心扩散控制的位错爬升是复合合金的蠕变机制。还评估了其他机械性能，包括弹性模量和硬度，并与纳米复合合金在各种填料负载下的微观结构演变有关。这项工作还比较了非反应性填料与反应性填料在提高 SnBi 合金抗蠕变性方面的有效性。推荐合适的填料候选物以获得 SnBi 复合合金的最佳机械性能。