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Microstructural evolution and properties of TLP diffusion bonding super-Ni/NiCr laminated composite to Ti-6Al-4V alloy with Cu interlayer
Materials & Design ( IF 7.6 ) Pub Date : 2017-12-01 , DOI: 10.1016/j.matdes.2017.09.028
Kun Liu , Yajiang Li , Chunzhi Xia , Juan Wang

Abstract Transient liquid phase (TLP) diffusion bonding super-Ni/NiCr laminated composite to Ti-6Al-4V alloy was performed at 950 °C with the pressure of 5 MPa. Two configurations (super-Ni/Cu/Ti-6Al-4V and Ni80Cr20/Cu/Ti-6Al-4V) were designed to explore interfacial microstructure evolution and mechanical properties. Results showed that the joint of laminated composite and Ti-6Al-4V alloy was mainly divided into two diffusion layers and a reaction layer. The interface was composed of Ni(Cu), Cu(Ni), Ti2Cu, TiCu, Ti3Cu4, Ti2Cu3 and Ti-Cu eutectic microstructure. The width of each layer increased with prolonging the bonding time and the growth rate of interfacial layers was dominated by the diffusion rate of alloying elements i.e. Cu, Ni and Ti. The maximum value of shear strength for both two configurations was about 58 MPa.

中文翻译:

TLP扩散结合超Ni/NiCr层状复合材料与Cu夹层Ti-6Al-4V合金的显微组织演变及性能

摘要 瞬态液相(TLP)超Ni/NiCr层合复合材料与Ti-6Al-4V合金在950 ℃、5 MPa压力下进行扩散结合。设计了两种配置(super-Ni/Cu/Ti-6Al-4V 和 Ni80Cr20/Cu/Ti-6Al-4V)来探索界面微观结构演变和机械性能。结果表明,层状复合材料与Ti-6Al-4V合金的接头主要分为两个扩散层和一个反应层。界面由Ni(Cu)、Cu(Ni)、Ti2Cu、TiCu、Ti3Cu4、Ti2Cu3和Ti-Cu共晶组织组成。每层的宽度随着键合时间的延长而增加,界面层的生长速率受合金元素Cu、Ni和Ti的扩散速率支配。两种配置的剪切强度最大值约为 58 MPa。
更新日期:2017-12-01
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