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代表成果
[1] 曾正. SiC功率器件的封装测试与系统集成[M]. 北京: 科学出版社, 2020.
[2] 曾正, 赵荣祥, 杨欢. 柔性并网逆变器控制技术[M]. 北京: 科学出版社, 2020.
[3] Wang Yulei, Gong Jiakun, Zeng Zheng, Wang Liang, Zou Mingrui, Gong Yiming, Liang Yuxi. Flexible 1.5-GHz probe isolation extension with high CMRR and robust dv/dt immunity empowering next-generation WBG measurement[J]. IEEE Transactions on Power Electronics, 2025, 40(1): 862-878.
[4] Zeng Zheng, Zhang Xin, Blaabjerg Frede, Miao Linjing. Impedance-oriented transient instability modeling of SiC MOSFET intruded by measurement probes[J]. IEEE Transactions on Power Electronics, 2020, 35(2): 1866-1881.
[5] Zeng Zheng, Zhang Xin, Li Xiaoling. Layout-dominated dynamic current imbalance in multichip power module: Mechanism modeling and comparative evaluation[J]. IEEE Transactions on Power Electronics, 2019, 34(11): 11199-11214.
科研成果
[25] Gong Jiakun, Wang Yulei, Wang Liang, Zou Mingrui, Sun Peng, Liang Yuxi, Gong Yiming, Zheng Huayang, Zeng Zheng. Overcurrent protection enabled by broadband Rogowski coil current sensor for medium voltage SiC MOSFET[J]. IEEE Transactions on Power Electronics, 2025, 40(PP): 1-1.
[24] Sun Peng, Pan Xiaofei, Zeng Zheng, Huang Yukai, Hu Yihua, Zou Mingrui. An overview of mechanical characterization for power module: Challenges, advances and future prospects[J]. IEEE Transactions on Power Electronics, 2025, 40(3): 4112-4130.
[23] Wang Yulei, Gong Jiakun, Zeng Zheng, Wang Liang, Zou Mingrui, Gong Yiming, Liang Yuxi. Flexible 1.5-GHz probe isolation extension with high CMRR and robust dv/dt immunity empowering next-generation WBG measurement[J]. IEEE Transactions on Power Electronics, 2025, 40(1): 862-878.
[22] Wang Yulei, Gong Jiakun, Zou Mingrui, Wang Liang, Gong Yiming, Jiang Chaoqiang, Zeng Zheng. Miniaturized current shunt with high bandwidth and low parasitics for high-integrated applications: Electro-thermal considerations and co-design[J]. IEEE Transactions on Power Electronics, 2024, 39(12): 15732-15747.
[21] Wang Liang, Zheng Huayang, Wang Yulei, Gong Jiakun, Hu Borong, Mu Wei, Li Jiayu, Long Teng, Zeng Zheng. Forced fluorinated liquid cooling for medium voltage SiC power modules: Concurrently addressing electrical and thermal challenges[J]. IEEE Transactions on Power Electronics, 2024, 39(12): 15622-15634.
[20] Sun Peng, Pan Xiaofei, Han Xudong, Zheng Huayang, Liang Yuxi, Hu Yihua, Niu Fuli, Zeng Zheng. Simultaneous mitigation of switching overvoltage and oscillation for SiC MOSFET via gate charge injection concept[J]. IEEE Transactions on Power Electronics, 2024, 39(11): 14376-14386.
[19] Wang Yulei, Gong Jiakun, Wang Liang, Zou Mingrui, Gong Yiming, Niu Fuli, Long Teng, Zeng Zheng. High-bandwidth differential voltage probe for accurate switching characterization of WBG devices[J]. IEEE Transactions on Power Electronics, 2024, 39(10): 12545-12557.
[18] Wang Liang, Gong Jiakun, Long Teng, Wang Yulei, Zheng Huayang, Hu Borong, Mu Wei, Zeng Zheng. A review of partial discharge in medium voltage SiC power modules under square wave excitation: Characterization, mitigation, and detection[J]. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2024, 12(4): 3588-3606.
[17] Wang Liang, Gong Jiakun, Long Teng, Blaabjerg Frede, Hu Borong, Wang Yulei, Zeng Zheng. Direct metallization-based DBC-free power modules for near-junction water cooling: Analysis and experimental comparison[J]. IEEE Transactions on Power Electronics, 2024, 39(6): 7052-7063.
[16] Sun Peng, Zou Mingrui, Wang Yulei, Gong Jiakun, Liang Yuxi, Niu Fuli, Jiang Ke, Gao Wei, Zeng Zheng. Focuses and concerns of dynamic test for wide bandgap device: A questionnaire-based survey[J]. IEEE Transactions on Power Electronics, 2023, 38(12): 15522-15534.
[15] Wang Yulei, Long Teng, Zou Mingrui, Sun Peng, Gong Jiakun, Wang Liang, Shillaber Luke, Blaabjerg Frede, Jiang Ke, Zeng Zheng. Transmission line Rogowski coil: Isolated current sensor with bandwidth exceeding 3 GHz for wide-bandgap device[J]. IEEE Transactions on Power Electronics, 2023, 38(11): 13599-13605.
[14] Sun Peng, Zou Mingrui, Niu Fuli, Liang Yuxi, Gong Jiakun, Wang Yulei, Luo Ming, Song Junwei, Zeng Zheng. Dynamic deformation oriented thermo-mechanical performance assessment for automotive power module with various PWM schemes[J]. IEEE Transactions on Power Electronics, 2023, 38(9): 10906-10916.
[13] Sun Peng, Liang Yuxi, Wang Liang, Wang Yulei, Zou Mingrui, Zeng Zheng. In situ full-field deformation characterization of power module and FEA model calibration based on stereo digital image methodology[J]. IEEE Transactions on Power Electronics, 2023, 38(7): 8430-8441.
[12] Sun Peng, Niu Fuli, Zeng Zheng, Li Kaiyan, Ou Kaihong. FEA-dominant reliability and lifetime model of double-sided cooling SiC power module[J]. IEEE Transactions on Device and Materials Reliability, 2023, 23(2): 178-186.
[11] Wang Yulei, Zeng Zheng, Long Teng, Sun Peng, Wang Liang, Zou Mingrui. Impedance-matching shunt (IM-Shunt): Current sensor with ultra-high bandwidth and extremely-low parasitics for wide-bandgap device[J]. IEEE Transactions on Power Electronics, 2022, 37(10): 11528-11533.
[10] Wang Liang, Zeng Zheng, Sun Peng, Ai Shengxiang, Zhang Jiawei, Wang Yulei. Electric-field-dominated partial discharge in medium voltage SiC power module packaging: Model, mechanism, reshaping, and assessment[J]. IEEE Transactions on Power Electronics, 2022, 37(5): 5422-5432.
[9] Sun Peng, Zeng Zheng, Wang Liang, Wang Yulei, Han Xudong. Online deformation characterization for electrothermal-mechanical effect of power module via confocal methodology[J]. IEEE Transactions on Power Electronics, 2022, 37(2): 1195-1200.
[8] Wang Liang, Zeng Zheng, Sun Peng, Yu Yue, Ou Kaihong, Wang Jin. Current-bunch concept for parasitic-oriented extraction and optimization of multi-chip SiC power module[J]. IEEE Transactions on Power Electronics, 2021, 36(8): 8593-8599.
[7] Zeng Zheng, Wang Jin, Wang Liang, Yu Yue, Ou Kaihong. Inaccurate switching loss measurement of SiC MOSFET caused by probes: Modelization, characterization, and validation[J]. IEEE Transactions on Instrumentation and Measurement, 2021, 70, 1002014.
[6] Zeng Zheng, Ou Kaihong, Wang Liang, Yu Yue. Reliability-oriented automated design of double-sided cooling power module: A thermo-mechanical-coordinated and multi-objective-oriented optimization methodology[J]. IEEE Transactions on Device and Materials Reliability, 2020, 20(3): 584-595.
[5] Zeng Zheng, Ou Kaihong, Wang Liang, Yu Yue. Reliability-oriented automated design of double-sided cooling power module: A thermo-mechanical-coordinated and multi-objective-oriented optimization methodology[J]. IEEE Transactions on Device and Materials Reliability, 2020, 20(3): 584-595.
[4] Zeng Zheng, Zhang Xin, Blaabjerg Frede, Miao Linjing. Impedance-oriented transient instability modeling of SiC MOSFET intruded by measurement probes[J]. IEEE Transactions on Power Electronics, 2020, 35(2): 1866-1881.
[3] Zeng Zheng, Zhang Xin, Zhang Zhe. Imbalance current analysis and its suppression methodology for parallel SiC MOSFETs with aid of a differential mode choke[J]. IEEE Transactions on Industrial Electronics, 2020, 67(2): 1508-1519.
[2] Zeng Zheng, Zhang Xin, Li Xiaoling. Layout-dominated dynamic current imbalance in multichip power module: Mechanism modeling and comparative evaluation[J]. IEEE Transactions on Power Electronics, 2019, 34(11): 11199-11214.
[1] Zeng Zheng, Li Xiaoling. Comparative study on multiple degrees of freedom of gate driver for transient behavior regulation of SiC MOSFET[J]. IEEE Transactions on Power Electronics, 2018, 33(10): 8754-8763.
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