近期论文
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Zicheng Sa, Shang Wang*, Jiayun Feng, Jiayue Wen, Xudong Liu, Yanhong Tian*. Study on Cu6Sn5 morphology and grain orientation transition at the interface of (111) nt-Cu and liquid Sn. Journal of Materials Research and Technology, 2023, 26: 9112-9126
Guifang Zeng, Qing Sun*, Sharona Horta, Shang Wang*, Xuan Lu, Chaoyue Zhang, Jing Li, Junshan Li, Lijie Ci, Yanhong Tian*, Maria Ibánez, Andreu Cabot*. A Layered Bi2Te3@PPy Cathode for Aqueous Zinc Ion Batteries: Mechanism and Application in Printed Flexible Batteries. Advanced Materials, 2023, 2305128. (Accepted, https://doi.org/10.1002/adma.202305128)
Shang Wang, Guifang Zeng, Qing Sun*, Yan Feng, Xinxin Wang, Xinyang Ma, Jing Li, He Zhang, Jiayue Wen, Jiayun Feng, Lijie Ci*, Andreu Cabot*, Yanhong Tian*. Flexible Electronic Systems via Electrohydrodynamic Jet Printing: A MnSe@rGO Cathode for Aqueous Zinc-Ion Batteries. ACS Nano, 2023, 17(14): 13256–13268
Qing Sun, Guifang Zeng, Jing Li, Shang Wang*, Marc Botifoll, Hao Wang, Deping Li, Fengjun Ji, Jun Cheng, Huaiyu Shao, Yanhong Tian*, Jordi Arbiol, Andreu Cabot*, and Lijie Ci*. Is Soft Carbon a More Suitable Match for SiOx in Li-Ion Battery Anodes?. Small, 2023, 19(37): 2302644
Qing Sun, Jing Li, Maoxiang Yang, Shang Wang*, Guifang Zeng, Hongbin Liu*, Jun Cheng, Deping Li, Youri Wei, Pengchao Si, Yanhong Tian*, and Lijie Ci*. Carbon Microstructure Dependent Li-Ion Storage Behaviors in SiOx/C Anodes. Small, 2023, 19(25): 2300759
Xuanyi Hu, Jiayun Feng, He Zhang, Jingxuan Ma, Zhuohuan Wu, Jiayue Wen, Shang Wang*, Yanhong Tian*. Electrohydrodynamic Printing of High‐Resolution Self‐Reduced Soldered Silver Nanowire Pattern for Wearable Flexible Strain Sensors. Advanced Materials Technologies, 2023, 2300759
Qing Sun, Maoxiang Yang, Guifang Zeng, Jing Li, Zhibiao Hu, Deping Li*, Shang Wang*, Pengchao Si*, Yanhong Tian, Lijie Ci*. Insights into the Potassium Ion Storage Behavior and Phase Evolution of a Tailored Yolk–Shell SnSe@C Anode. Small, 2022, 18, 2203459
王尚, 马竟轩, 杨东升, 徐佳慧, 杭春进, 田艳红*. 射频器件超细引线键合射频性能仿真. 焊接学报, 2021, 42(10): 1-7
Xuanyi Hu, Shang Wang*, He Zhang, Yiping Wang, Chunjin Hang, Jiayua Wen, Yanhong Tian*, Silver flake/polyaniline composite ink for electrohydrodynamic printing of flexible heaters. Journal of Materials Science: Materials in Electronics, 2021, 32: 27373–27383
王尚, 王凯枫, 张贺, 徐佳慧, 杨东升, 杭春进, 田艳红*.射频器件超细引线键合工艺及性能研究. 机械工程学报, 2021,57(22):201-208
Shang Wang, He Zhang, Chunjin Hang*, Jiayun Feng, Zicheng Sa, Yue Li, Weiwei Zhang, Yanhong Tian*, Phase transformation behavior of Al-Au-Cu intermetallic compounds under ultra-fast micro resistance bonding process. Materials Characterization, 2021, 180: 111401
He Zhang, Yanhong Tian*, Shang Wang*, Jiayun Feng, Chunjin Hang, Chenxi Wang, Jingxuan Ma, Xuanyi Hu, ZhenZheng, Huijuan Dong, Robust Cu-Au alloy nanowires flexible transparent electrode for asymmetric electrochromic energy storage device. Chemical Engineering Journal, 2021, 426: 131438
Shang Wang, Yan Feng, He Zhang, Qiqi Peng, Yanhong Tian*, Highly stable and printable Ag NWs/GO/PVP composite ink for flexible electronics. Flexible and Printed Electronics, 2021, 6: 024002
Zhen Zeng, Shang Wang, Jun Cheng, Guangmei Hou, Deping Li, Guifang Han*, and Lijie Ci*, Spontaneous In Situ Surface Alloying of Li-Zn Derived from a Novel Zn2+-Containing Solid Polymer Electrolyte for Steady Cycling of Li Metal Battery. ACS Sustainable Chemistry & Engineering, 2021, 9 (11): 4282-4292
Shang Wang, He Zhang, Yue Li, Weiwei Zhang, Chunjin Hang, Yanhong Tian*, Transient solid-liquid interfacial reaction between Al wire and Au/Cu pad during parallel gap micro-resistance welding, Materials Letters, 2021, 288: 129340
He Zhang#, Shang Wang#, Yanhong Tian*, Yubin Liu, Jiayue Wen, Yilong Huang, Chunjin Hang, Zhen Zheng, Chenxi Wang, Electrodeposition fabrication of Cu@ Ni core-shell nanowire network for highly stable transparent conductive films, Chemical Engineering Journal, 2020, 390: 124495
He Zhang#, Shang Wang#, Yanhong Tian*, Jiayue Wen, Chunjin Hang*, Zhen Zheng, Yilong Huang, Su Ding, Chenxi Wang. High-efficiency extraction synthesis for high-purity copper nanowires and their applications in flexible transparent electrodes, Nano Materials Science, 2020, 2:164-171
Shang Wang, Yanhong Tian*, Chenxi Wang, Chunjin Hang, Yilong Huang, Chao Liao. Chemical and thermal robust tri-layer rGO/Ag NWs/GO composite film for wearable heaters, Composites Science and Technology, 2019, 174: 76-83
Shang Wang, Yanhong Tian*, Chenxi Wang, Chunjin Hang, He Zhang, Yuan Huang, Zhen Zheng. One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors, ACS Omega, 2019, 4: 6092-6096
Shang Wang, Yanhong Tian*, Chenxi Wang, Chunjin Hang, Communication—Ag NW Networks Enhanced by Ni Electroplating for Flexible Transparent Electrodes, Journal of the Electrochemical Society, 2018, 165(9): D328-D330
Shang Wang, Yanhong Tian*, Chunjin Hang, Chenxi Wang. Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining, Scientific Reports, 2018, 8:5260
会议论文
Shang Wang, Xinxin Wang, Yan Feng, Geng Li, Xinyang Ma, Yanhong Tian*, Synthesis and Performance Analysis of MnSe@rGO for Aqueous Zinc-ion Batteries, 9th International Conference on Welding Science and Engineering (WSE2023), 2023, China (邀请报告)
Shang Wang, Xuanyi Hu, Yan Feng, Jingxuan Ma, Songzhuo Ren, Yanhong Tian*, Silver ions assisted nanosoldering electrohydrodynamic (EHD) printing of RFID antennas, 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022, China (Keynote)
王尚，撒子成，田艳红. 微波组件平行封焊过程有限元仿真及工艺优化，第二十四次全国焊接学术会议，2020，中国（分会报告）
Shang Wang, Yanhong Tian*. Electroplating Enhanced Silver Nanowire Networks for Transparent Heaters, IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, USA
Shang Wang, Yanhong Tian*, Jie Yu. Synthesis of ultra-long silver nanowires and the joining of silver networks, Semiconductor Technology International Conference (CSTIC), 2016, China（分会报告）
Shang Wang, Yanhong Tian*, Xuguang Guo, Fatigue life prediction for CBGA under random vibration loading by finite element method, 15th International Conference on Electronic Packaging Technology (ICEPT), 2014, China（分会报告）
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