个人简介
王晨曦，男，1980年10月出生于黑龙江省伊春市，博士，教授，博士生导师，材料学院焊接系电子封装技术专业/先进焊接与连接国家重点实验室教师。
日本东京大学博士，主要研究方向为芯片键合、异质异构晶圆键合、三维集成与封装、医用新材料连接。曾获日本学术振兴会(JSPS)外国人特别研究员奖励资助，作为主任研究员曾参与日本科技振兴机构战略创造推进事业重大项目(JST-CREST)。回国后主持国家省部级等十余项课题，其中国家自然科学基金3项（重大研发计划、面上、青年各一项），在ACS Nano, Acta Biomaterialia, ACS AMI，Corrosion Science, JMST, Scripta Materialia, APL等期刊和国际会议上发表SCI/EI论文110余篇，其中以第一/通讯作者发表IF>5.0论文19篇，5篇论文入选期刊封面图片，6篇论文获国际会议最佳论文奖、最佳口头报告奖和杰出论文奖，博士论文获东京大学工学院院长奖。已授权中国发明专利14项和日本发明专利2项，国际会议特邀报告5次，2017年至今担任电子封装技术国际会议(ICEPT)分会场主席，目前担任中国机械工程学会焊接分会委员会委员、电子封装国际会议学术委员会委员，IEEE Senior Member，中国机械工程学会高级会员，获2021年黑龙江省自然科学一等奖。教学方面获黑龙江省高校课程思政教学竞赛一等奖，哈工大首届课程思政教学竞赛一等奖，哈工大研究生课程教学竞赛一等奖，哈工大教学优秀奖一等奖，主持承担省级和校级教研项目4项。
教育经历
1998年--2002年 哈尔滨工业大学 材料学院 焊接系 本科 (英才学院本硕连读）
2002年--2004年 哈尔滨工业大学 材料学院 焊接系 硕士
2004年--2005年 新加坡国立大学 机械工程系 研究生
2005年2月--9月 东北师范大学 留日本预备学校 日语学习
2005年--2009年 东京大学 精密机械工程系 博士 (获日本政府文部省奖学金)
工作经历
2009年8月 - 2011年7月 东京大学 工学系研究科 日本学术振兴会特别研究员(JSPS fellow)
2011年10月 - 2014年12月 东京大学 工学系研究科 主任研究员
2014年12月- 2019年12月 哈尔滨工业大学 材料学院 副教授
2018年4月- 至今 哈尔滨工业大学 材料学院 博士生导师
2019年12月- 至今 哈尔滨工业大学 材料学院 教授
获奖情况
2003年年获电子封装国际会议大会最佳论文奖(Best Paper Award of ICEPT2003)
2004年获哈尔滨工业大学首届研究生“十佳英才”
2005年获日本文部科学省国费奖学金 (2005-2008年)
2007年获电子封装国际会议大会最佳论文奖(NXP Semiconductor Best Paper Award)
2007年 国家优秀自费留学生奖学金
2010年 博士论文获东京大学工学院院长奖
2009年获日本学术振兴会(JSPS)外籍特别研究员奖励基金(2009-2011)
2010年获电子封装国际会议大会杰出论文奖(JCET Outstanding Paper Award)
2010年合作论文获IEEE-CPMT Japan Symposium青年学者论文奖(Young Award)
2011年获2nd Advanced Welding & Joining Technology Conference最佳报告奖(Best Presentation Award)
2011年获电子封装国际会议大会杰出论文奖(JCET Outstading Paper Award)
2016年 哈尔滨工业大学“优秀专兼职工作者”荣誉称号 (班主任)
2017年 哈尔滨工业大学“优秀专兼职工作者标兵”荣誉称号 (班主任)
2017年获电子封装国际会议大会杰出论文奖(ICEPT Outstanding Paper Award)
2018年获哈尔滨工业大学第六届青年教师研究生课程教学竞赛一等奖
2018年获哈尔滨工业大学百优本科毕业论文指导教师（学生：康秋实)
2019年获哈尔滨工业大学首届课程思政教学竞赛一等奖
2020年获哈尔滨工业大学优秀硕士学位论文指导教师（学生：康秋实）
2020年获哈尔滨工业大学教学优秀奖一等奖
2021年获哈尔滨工业大学优秀硕士学位论文指导教师（学生：周诗承）
2021年获电子封装国际会议大会学生最佳论文奖(Best Student Paper Award, 指导教师)
2021年获黑龙江省自然科学一等奖（排名5）
2022年获黑龙江省第二届高等学校课程思政教学竞赛一等奖
2022年获哈尔滨工业大学优秀博士学位论文指导教师（学生：方慧）
2023年获第三届黑龙江省高校教师教学创新大赛一等奖
2023年获哈尔滨工业大学本科优秀毕业论文指导教师（学生：刘凯盟)
2023年获哈尔滨工业大学优秀硕士学位论文指导教师（学生：李戈）
研究领域
芯片键合新技术
晶圆键合关键技术与装备
三维集成与封装
精密焊接与微纳连接
医用新材料连接
近期论文
查看导师最新文章
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Transition-free indirect bonding towards 3D multi-layer glass stacking
A two-step surface treatment for enhanced hydroxide-catalyzed glass bonding
Room-temperature bonding of glass chips via PTFE-assisted plasma modification for nanofluidic applications
Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO2 hybrid bonding
Recent progress on bumpless Cu/SiO 2 hybrid bonding for 3D heterogeneous integration
Research progress on micro/nano joining technologies and failure behaviors in electronic packaging
Room-temperature nanojoining of silver nanowires by graphene oxide for highly conductive flexible transparent electrodes
Hybrid Plasma Activation Strategy for the Protein‐Coated Magnesium Implants in Orthopedic Applications (Adv. Mater. Interfaces 9/2022)
One-step PDA coating strategy on pure Zn for blood-contacting engineering
Communication—Hollow MnOx@Nanoparticles Electrospun Fibers with High Porosity for Formaldehyde Removal at Room Temperature
Hybrid Plasma Activation Strategy for the Protein‐Coated Magnesium Implants in Orthopedic Applications
High-Efficient Vacuum Ultraviolet-Ozone Assist-Deposited Polydopamine for Poly(lactic- co -glycolic acid)-Coated Pure Zn toward Biodegradable Cardiovascular Stent Applications
Robust Cu-Au alloy nanowires flexible transparent electrode for asymmetric electrochromic energy storage device
A multifunctional osteogenic system of ultrasonically spray deposited bone-active coatings on plasma-activated magnesium
Low-Temperature Co-hydroxylated Cu/SiO 2 Hybrid Bonding Strategy for a Memory-Centric Chip Architecture
Fabrication of Ag@Ag2O-MnOx composite nanowires for high-efficient room-temperature removal of formaldehyde
Exploration of the enhanced performances for silk fibroin/sodium alginate composite coatings on biodegradable Mg?Zn?Ca alloy
Investigation of Plasma Activation Directions for Low-Damage Direct Bonding
Nanometer-Scale Heterogeneous Interfacial Sapphire Wafer-Bonding for Enabling Plasmonic-Enhanced Nanofluidic Mid-Infrared Spectroscopy
Recycled low-temperature direct bonding of Si/glass and glass/glass chips for detachable micro/nanofluidic devices
Single-crystalline SiC integrated onto Si-based substrates via plasma-activated direct bonding
Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste
Highly stable flexible transparent electrode via rapid electrodeposition coating of Ag-Au alloy on copper nanowires for bifunctional electrochromic and supercapacitor device
Direct bonding of high dielectric oxides for high-performance transistor applications
Fabrication and characterization of silk fibroin coating on APTES pretreated Mg-Zn-Ca alloy
Electrodeposition fabrication of Cu@Ni core shell nanowire network for highly stable transparent conductive films
Enhanced adhesion and anticorrosion of silk fibroin coated biodegradable Mg-Zn-Ca alloy via a two-step plasma activation
Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics
Rapid Sintering of Nano Copper-Silver Core-Shell Paste and Interconnection of Copper Substrates by Pulse Current
Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging
High-efficiency extraction synthesis for high-purity copper nanowires and their applications in flexible transparent electrodes
VUV/O3 activated direct heterogeneous bonding towards high-performance LiNbO3-based optical devices
Moiré-Based Alignment Using Centrosymmetric Grating Marks for High-Precision Wafer Bonding
Low-temperature direct bonding of Si and quartz glass using the APTES modification
One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors
Silk fibroin film-coated MgZnCa alloy with enhanced in vitro and in vivo performance prepared using surface activation
Chemical and thermal robust tri-layer rGO/Ag NWs/GO composite film for wearable heaters
A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package
A facile method for direct bonding of single-crystalline SiC to Si, SiO2, and glass using VUV irradiation
Fabrication of SiC/Si, SiC/SiO2, and SiC/glass heterostructures via VUV/O3 activated direct bonding at low temperature
Glass-on-LiNbO 3 heterostructure formed via a two-step plasma activated low-temperature direct bonding method
Direct bonding of silicon and quartz glass using VUV/O 3 activation and a multistep low-temperature annealing process
Communication—A Self-Contained Temperature Sensing Approach for Ultrafast Microwelding
Effect of electric current on grain orientation and mechanical properties of Cu-Sn intermetallic compounds joints
Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining
Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz via VUV/O3 activation
Communication—Evaporation Driven Micro/Nanofluidic Pumping Device
Low-temperature wafer direct bonding of silicon and quartz glass by a two-step wet chemical surface cleaning
Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current
Direct Homo/Heterogeneous Bonding of Silicon and Glass Using Vacuum Ultraviolet Irradiation in Air
Room-Temperature Direct Heterogeneous Bonding of Glass and Polystyrene Substrates
Communication — Ag NW Networks Enhanced by Ni Electroplating for Flexible Transparent Electrodes
Communication—Defect-Free Direct Bonding for High-Performance Glass-On-LiNbO 3 Devices
Micro heat pipe device utilizing extended nanofluidics
Room-temperature direct bonding of silicon and quartz glass wafers
Mechanisms for Room-Temperature Fluorine Containing Plasma Activated Bonding
Investigation of Thermal Treatment Processes for Dissimilar Wafer Bonding
Investigation of Thermal Treatment Processes for Dissimilar Wafer Bonding
Clogging-Free Irreversible Bonding of Polycarbonate Membranes to Glass Microfluidic Devices
Enhanced shear strength of Cu–Sn intermetallic interconnects with interlocking dendrites under fluxless electric current-assisted bonding process
Ultrafast formation of unidirectional and reliable Cu3Sn-based intermetallic joints assisted by electric current
Implementation of Unscented Kalman Filter-Based Online State-of-Charge Estimation in LiFePO 4 Battery-Powered Electric Vehicle Applications
A Comparative Study: Void Formation in Silicon Wafer Direct Bonding by Oxygen Plasma Activation with and without Fluorine
Low-temperature bonding process for the fabrication of hybrid glass–membrane organ-on-a-chip devices
Mechanical Properties and Fracture Mechanisms of Sn-3.0Ag-0.5Cu Solder Alloys and Joints at Cryogenic Temperatures
Interfacial behavior between silver-plated copper wire and PCB pad during parallel micro gap welding
Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress
A Study of Void Formation in Fluorine Containing Plasma Activated Wafer Bonding
A Study of Void Formation in Fluorine Containing Plasma Activated Wafer Bonding
Unscented Kalman Filter-Based Online State-of-Charge Estimation in LiFePO 4 Battery-Powered Electric Vehicles
Extremely fast formation of Cu–Sn intermetallic compounds in Cu/Sn/Cu system via a micro-resistance spot welding process
Communication—Fluorinated Plasma Treatments Using PTFE Substrates for Room-Temperature Silicon Wafer Direct Bonding
Facile Synthesis of Cu-Ag Hybrid Nanowires with Strong Surface-enhanced Raman Scattering Sensitivity
Sintering mechanism of the Cu-Ag core-shell nanoparticle paste at low temperature in ambient air
学术兼职
中国机械工程学会焊接分会 委员（2022年-至今）
中国机械工程学会极端制造分会 委员（2022年-至今）
IEEE Senior Member（2021年-至今)
中国机械工程学会高级会员（2022年-至今）
IEEE国际集成电路技术与应用国际会议(ICTA)封装分委会主席（2021-2022年)
电子封装技术国际会议(ICEPT) 学术委员会委员（2017年-至今）
美国电化学学会(ECS)会员 (2008-2020年)
广东省电子学会SMT专委会资深专家委员(2018年-至今)
东京大学中国留学人员友好联谊会 学术部部长(2006-2007年）
多个国际期刊审稿人(部分期刊如下)：
Acta Materialia, Acta Biomaterialia, Nanoscale, Scripta Materialia, Applied Physics Letters, Applied Surface Sciences, Scientific Reports, IEEE Journal of Microelectromechanical Systems, Journal of Materials Science & Technolgy, Journal of Magnesium and Alloys, Journal of the European Ceramic Society, Ceramics International, Journal of Materials Processing Technology, Journal of Alloys and Compounds, Journal of The Electrochemical Society, Materials Letters, Sensors and Actuators A, ECS Journal of Solid State Sci. Tech., IEEE Acess, Microelectronics Reliablility, Micromachines, Japanese Journal of Applied Physics, Microelectronics Engineering
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