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Zhu Lihua, Fan Xiaole, Xiao Lei, Ji Hongjun, Guo Jianzheng, Influence of shot peening on the microstructure and high-temperature tensile properties of a powder metallurgy Ni-based superalloy. Journal of Materials Science, 2023, 58 (6): 2838-2852.
Zhang Wenwu, Zhang Penghao, Lu Dash, Pan Hao, Liu Xiangli, Xu Chengyan, Wei Jun, Li Mingyu, Ji Hongjun, A supersaturated Cu-Ag nanoalloy joint with ultrahigh shear strength and ultrafine nanoprecipitates for power electronic packaging, Journal of Materials Science & Technology, 2023, 145:56-65.
Zheng Xiaoxiong, Ma, Qiuchen, Tao, Yuan, Huang, Yan, Li, Mingyu, Ji, Hongjun, Ultrasonic-Excited Ultrafast Seamless Integration of Heterostructured Liquid Crystalline Elastomers for Multi-responsive Soft Actuators, ACS Applied Materials & Interfaces, 2023, 15(10):13609-13617.
Yin Li, Yang Fan, Bao Xin, Xue Wenhua, Du Zhipeng, Wang Xinyu, Cheng Jinxuan, Ji Hongjun, Sui Jiehe, Liu Xingjun, Wang Yumei, Cao Feng, Mao Jun, Li Mingyu, Ren Zhifeng, Zhang Qian, Low-temperature sintering of Ag nanoparticles for high-performance thermoelectric module design. Nature Energy, 2023, 8 (7): 665-674.
Zhan Limeng, Cao Yang, Gao Yifan, Meng Shuaishuai, Ji Hongjun, Li Mingyu, Wei Jun, Feng Huanhuan, Additively Fabricated Electronic Skin with High Performance in Dynamic Sensing as Human Skin. ACS Applied Electronic Materials, 2023 5(4): 2017-2025.
Wei Binbin, Wang Zitian, Guo Haotian, Xie Fei, Cheng Simin, Lou Zirui, Zhou Changjie, Ji Hongjun, Zhang Min, Wang Xiaohao, Jiao Xuechen, Ma Shaohua, Cheng Hui-Ming, Xu Xiaomin, Ultraflexible tattoo electrodes for epidermal and in vivo electrophysiological recording. Cell Reports Physical Science, 2023, 4 (4).
Peng Fei, Zhu Wenbo, Fang Yi, Fu Bicheng, Chen Hongtao, Ji Hongjun, Ma Xing, Hang Chunjin, Li Mingyu, Ultralight and Highly Conductive Silver Nanowire Aerogels for High-Performance Electromagnetic Interference Shielding. ACS Applied Materials & Interfaces, 2023, 15 (3): 4284-4293.
Pan Hao, Zhu Lihua, Cheng Junyi, Xiao Lei, Ji Hongjun, Size-dependent microstructure evolution and formation mechanisms during the gas atomization process of FGH4113A Ni-based superalloy powder. Vacuum, 2023, 209.
Pan Hao, Lu Dashi, Zhu Lihua, Li Mingyu, Ji Hongjun, Tailoring thermal behavior and solid-liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process. Journal of Materials Science-Materials in Electronics, 2023, 34 (3).
Ma Qiuchen, Ma Jingyuan, Zhou Jianli, Zheng Xiaoxiong, Ji Hongjun, Dislocation behavior in Cu single crystal joints under the ultrasonically excited high-strain-rate deformation. Journal of Materials Science & Technology, 2023, 141: 66-77.
Lin Yixuan, Qi Xiaoquan, Niu Guoqiang, Sun Qin, Ji Hongjun, Li Mingyu, Li Yufeng, Surface metallization of Si3N4 ceramics with highperformance silver thick paste containing Bi-B-Zn glass frit. Journal of Materials Science, 2023, 58 (23): 9395-9408.
Sun Qin, Yang Ludong, Yang Wanchun, Ji Hongjun, Li Mingyu, Li Yufeng, Microstructure evolution and bonding mechanism of ZrO2 ceramic and Ti-6Al-4V alloy joints brazed by Bi2O3-B2O3-ZnO glass paste. Journal of the European Ceramic Society, 2022, 42 (13): 5953-5963.
Gao Yifan, Wang Min, Zhang Zhen, Liu Yaming, Zhang Jiaheng, Li Mingyu, Ji Hongjun, Zhao Weiwei, Wang Junyou, Feng Huanhuan, Flash Nanoprecipitation Offers Large-Format Full-Color and Dual-Mode Fluorescence Patterns for Codes-in-Code Encryption and Anti-Counterfeiting. Advanced Photonics Research, 2022, 3 (11).
Gao Yifan, Wang Min, Zhang Zhen, Liu Yaming, Hu Shaowei, Liu Gaixia, Ji Hongjun, Zhao Weiwei, Ma Xing, Zhang Jiaheng, Li Mingyu, Wei Jun, Feng Huanhuan, Facile Conjugated-Polymer-Based Flexible Lighting Fabrication and Microdeformation Monitoring. Advanced Photonics Research, 2022, 3 (10).
Feng Huanhuan, Liu Yaming, Feng Liang, Zhan Limeng, Meng Shuaishuai, Ji Hongjun, Zhang Jiaheng, Li Mingyu, He Peng, Zhao Weiwei, Wei Jun, Additively Manufactured Flexible Electronics with Ultrabroad Range and High Sensitivity for Multiple Physiological Signals' Detection. Research, 2022, 2022.
Cui Peng, Zhu Wenbo, Ji Hongjun, Chen Hongtao, Hang Chunjin, Li Mingyu, Analysis and optimization of induction heating processes by focusing the inner magnetism of the coil. Applied Energy, 2022, 321.
Zhu Lihua, Pan Hao, Cheng Junyi, Xiao Lei, Guo Jianzheng, Ji Hongjun, Dendrite evolution and quantitative characterization of gamma ' precipitates in a powder metallurgy Ni-based superalloy by different cooling rates, Journal of Alloys and Compounds, 2022,918.
Ma Qiuchen, Ma Jingyuan, Zhou Jianli, Ji Hongjun, Abnormal dislocation substructure in the ultrasonically welded joints of Cu single crystals, Science and Tehnology of Welding and Joining, 2022, 27 (8):606-614.
Zhang Wenwu, Zhou Yanhong, Ding Yiping, Song Linlin, Yuan Qunhui, Zhao Weiwei, Xu Chengyan, Wei Jun, Li Mingyu, Ji Hongjun, Sintering mechanism of size-controllable Cu-Ag core-shell nanoparticles for flexible conductive film with high conductivity, antioxidation, and electrochemical migration resistance, Applied Surface Science, 2022, 586:152691.
Hu Shaowei, Zhu Wenbo, Yang Wanchun, Ji Hongjun, Li Mingyu, Facile method for printing reliable sliver patterns on polymer film, Materials Letters, 2022, 314:131551.
Cheng Junyi, Zhu Lihua, Xiao Lei, Guo Jianzheng, Ji Hongjun, Microstructure and Mechanical Properties of New Third-Generation Nickel-Based Powder Superalloy, Rare Metal Materials and Engineering, 2022, 51:1478-1487.
Meng Shuaishuai, Wang Li, Ji Xixi, Yu Jie, Ma Xing, Zhang Jiaheng, Zhao Weiwei, Ji Hongjun, Li Mingyu, Feng Huanhuan, Facile Gold-Nanoparticle Boosted Graphene Sensor Fabrication Enhanced Biochemical Signal Detection, Nanomaterials, 2022, 12:1327.
Ma Qiuchen, Ma Jingyuan, Zhou Jianli, Ji Hongjun, Intrinsic dependence of welding quality and recrystallization on the surface-contacted micro-asperity scale during ultrasonic welding of Cu-Cu joints, Journal of Materials Research and Technology, 2022, 17:353-364.
张文武, 潘浩, 马秋晨, 李明雨, 计红军, 功率超声微纳电子封装互连技术研究进展, 机械工程学报, 2022, 58:100-121.
Wang Min, Jiang Kunkun, Gao Yifan, Liu Yaming, Zhang Zhenchao, Zhao Weiwei, Ji Hongjun, Zheng Tingting, Feng Huanhuan, A facile fabrication of conjugated fluorescent nanoparticles and micro-scale patterned encryption via high resolution inkjet printing, Nanoscale, 2021, 13:14337-14345.
Zhang Lin, Li Nuomei, Ma Qiuchen, Ding Jiahui, Chen Chuang, Hu Zhaocheng, Zhao Weiwei, Li Yufeng, Feng Huanhuan, Li Mingyu, Ji Hongjun. Large-area flexible and transparent UV photodetector based on cross-linked Ag NW@ZnO NRs with high performance, Journal of Materials Science & Technology, 2022, 110:65-72.
Ma Qiuchen, Cao Yichen, Zhang Wenwu, Zhao Weiwei, Chen Hongtao, Li Mingyu, Liang Zhimin, Xiao Yong, Ji Hongjun, Low energy ultrasonic welding for Cu-Cu joining accelerated via Cu nanoparticles, Journal of Materials Processing Technology, 2021, 296: 117210.
Ma Qiuchen, Song Cheng, Zhou Jianli, Zhang Lin, Ji Hongjun, Dynamic Weld evolution during ultrasonic welding of Cu-Al joints, Materials Science & Engineering A, 2021, 823: 141724.
Yang Fan, Zhu Wenbo, Wu, Weizhen, Ji, Hongjun, etc. Microstructural evolution and degradation mechanism of SiC-Cu chip attachment using sintered nano-Ag paste during high-temperature ageing, Journal of Alloys and Compounds, 2020, 846: 156442.
Wenwu, Zhang, Yichen Cao, Jiayi Huang, Weiwei Zhao, Xiangli, Liu, Mingyu Li，Hongjun Ji. Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: principle, kinetics, microstructure, and joint properties. Ultrasonics Sonochemistry, 2020, 66:105090.
Gu, Jiahui; Hu, Shaowei; Ji, Hongjun, etc. Multi-layer silver nanowire/polyethylene terephthalate mesh structure for highly efficient transparent electromagnetic interference shielding. Nanotechnology, 2020, 31(18): 185303.
Huang, C., et al., Ultrafast control of vortex microlasers. Science, 2020. 367(6481): 1018-1021.
Huaqiang Fu, Yong Xiao, Rongguo Song, Zhe Wang, Hongjun Ji, etc. Rapid soldering of flexible graphene assembled films at low temperature in air with ultrasonic assistance, Carbon, 2020, 158: 55-62.
Zhang, Changan, Ji, Hongjun, etc. Interfacial microstructure and mechanical properties of ultrasonic-assisted brazing joints between Ti–6Al–4V and ZrO2. Ceramics International, 2020, 46(6): 7733-7740.
Jiaao Yu, Lin Zhang, Hongjun Ji. Preparation of Nanometer Cu6Sn5 and Its Application in Lithium-Ion Batteries Anode for Mass Production. General Chemistry. 2020, 6 (1): 180028-180028. (Cover)
Yin F, Lu H, Pan H, Ji H*, et al. Highly sensitive and transparent strain sensors with an ordered Array structure of AgNWs for Wearable Motion and Health Monitoring. Scientific reports, 2019, 9(1): 2403.
Yang, H., et al., Nucleation behavior of Mg2Sn on Ta surface during ultrasonic-assisted soldering of Ta/Sn/Mg joint. Journal of Materials Science: Materials in Electronics, 2019. 30(18SI): 17239-17244.
Yang H, Tan Q, Ji H*, et al. Dissolution and nucleation behavior of Al in Ta/Sn/Al joints during ultrasonic-assisted soldering. Materials Letters, 2019, 252(1): 103-105.
Pan H, Ji H*, Liang M, et al. Size-Dependent Phase Transformation during Gas Atomization Process of Cu–Sn Alloy Powders. Materials, 2019, 12(2): 2452.
Jiang, K., et al., An invisible private 2D barcode design and implementation with tunable fluorescent nanoparticles. RSC Advances, 2019. 9(64): 37292-37299.
Feng H, Zheng T, Li M, Ji H, et al. Droplet‐based Microfluidics Systems in Biomedical Applications. Electrophoresis, 2019, 40(11): 1580-1590.
Feng P, Ji H, Zhang L, et al. Highly Stretchable Patternable Conductive Circuits and Wearable Strain Sensors based on Polydimethylsiloxane and Silver Nanoparticles. Nanotechnology, 2019, 30.
Hu B, Yang F, Peng Y, Ji H, et al. Rapid formation of Cu–Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste. Journal of Materials Science: Materials in Electronics, 2019, 30(8): 8071-8079.
Hu S, Gu J, Zhao W, Ji H, et al. Silver‐Nanowire Mesh‐Structured Transparent Conductive Film with Improved Transparent Conductive Properties and Mechanical Performance. Advanced Materials Technologies, 2019, 4: 1900194.
Du, Y., et al., Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding. Journal of Materials Science-Materials in Electronics, 2019. 30(14): 12840-12850.
Li, Y., et al., Self-assembly of nickel: from nanoparticles to foils with tunable magnetic properties. Crystengcomm, 2019. 21(35): 5317-5321.
Li Y, Wang Q, Wang Y, Ji H, et al. A flexible and conductive metallic paper-based current collector with energy storage capability in supercapacitor electrodes. Dalton Transactions, 2019, 48(22): 7659-7665.
Pan H, Huang J, Ji H*, et al. Enhancing the solid/liquid interfacial metallurgical reaction of Sn+ Cu composite solder by ultrasonic-assisted chip attachment. Journal of Alloys and Compounds, 2019, 784: 603-610.
Hongjun Ji, Junbo Zhou,Meng Liang, Huajun Lu,Mingyu Li,Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging, Ultrasonics Sonochemistry, 2018, 41: 375-381.
Hongjun Ji, Hao Chen, Mingyu Li, Overwhelming reaction enhanced by ultrasonics during brazing of alumina to copper in air by Zn-14Al hypereutectic filler, Ultrasonics Sonochemistry, 2017, 35: 61-71.
Zhongyang Liu,Hongjun Ji,Shuai Wang,Weiwei Zhao,Yan Huang,Huanhuan Feng,Jun Wei,Mingyu Li,Enhanced Electrical and Mechanical Properties of a Printed Bimodal Silver Nanoparticle Ink for Flexible Electronics,Physica status solidi a-applications and materials science, 2018, 215:1800007.
Jiahui Gu, Xuelin Wang, Hongtao Chen, Shihua Yang, Huanhuan Feng, Xing Ma, Hongjun Ji, Jun Wei,Mingyu Li,Conductivity enhancement of silver nanowire networks via simple electrolyte solution treatment and solvent washing, Nanotechnology, 2018, 29:265703.
Yahong Du,Zhi-Quan Liu,Hongjun Ji,Mingyu Li,Ming Wen,The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding,Journal of Materials Science: Materials in Electronics, 2018, 29: 13774-13781.
Hongjun Ji, Hao Chen, Mingyu Li, Effect of ultrasonic transmission rate on microstructure and properties of the ultrasonic-assisted brazing of Cu to alumina, Ultrasonics Sonochemistry, 2017, 34: 491-495.
C. Zhang, S. Pei, H. Ji*, Y. Cui and M. Li, Fabrication of Ni60–SiC coating on carbon steel for improving friction, corrosion properties, Materials Science and Technology, 2017, 33: 446-453.
Hongjun Ji, Jiao Wang, Mingyu Li, Microstructure and reliability of hybrid interconnects by Au stud bump with Sn-0.7Cu solder for flip chip power device packaging, Microelectronics Reliability, 2016, 66: 134-142.
Jingdong Liu,Hongtao Chen, Hongjun Ji, Mingyu Li, Highly Conductive Cu?Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles, ACS Applied Materials and Interfaces, 2016, 8: 33289-33298.
Jingdong Liu, Hongjun Ji, Shuai Wang, Mingyu Li, The low temperature exothermic sintering of formic acid treated Cu nanoparticles for conductive ink, Journal of Materials Science: Materials in Electronics, 2016, 27: 13280-13287.
Hongjun Ji, Xiao Cheng, Mingyu Li, Ultrafast ultrasonic-assisted joining of bare α-alumina ceramics through reaction wetting by aluminum filler in air, Journal of the European Ceramic Society, 2016, 36: 4339-4344.
Hongjun Ji, Minggang Li, Shu Ma, Mingyu Li, Ni3Sn4-composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging. Materials and Design, 2016, 108: 590-596.
Ming Yang, Hongjun Ji, Shuai Wang, Yong-Ho Ko, Chang-Woo Lee, Jianxin Wu, Mingyu Li, Effects of Ag content on the interfacial reactions between liquid Sn-Ag-Cu solders and Cu substrates during soldering, Journal of Alloys and Compounds, 2016, 679: 18-25.
Ming Yang, Shihua Yang, Hongjun Ji, Yong-Ho Ko, Chang-Woo Lee, Jianxin Wu, Mingyu Li, Microstructure evolution, interfacial reaction and mechanical properties of lead-free solder bump prepared by induction heating method, Journal of Materials Processing Technology 2016, 236: 84-92.
Hongjun Ji, Yufei Qiao, Mingyu Li, Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn-0.7Cu solder for high temperature packaging application. Scripta Materialia 2016, 110: 19-23.
Hongjun Ji, Qiang Wang, Mingyu Li, Microstructural evolution of lead-free solder joints in ultrasonic-assisted soldering. Journal of Electronic Materials 2016, 45: 88-97.
Hongjun Ji, Yuyou Ma, Mingyu Li,Chunqing Wang,Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering,Journal of Electronic Materials 2015, 44: 733-743.
Hongjun Ji, Long Li, Mingyu Li, Low-temperature joining of Fe-based amorphous foil with aluminum by ultrasonic-assisted soldering with Sn-based fillers. Materials and Design 2015, 84: 254-260.
Hongjun Ji, Long Li, Lijie Wang, Mingyu Li, Microstructures and properties of the Fe-based amorphous foil/aluminum dissimilar joint by ultrasonic-assited soldering. Welding in the World 2015, 59: 623-628.
Hongjun Ji, Junzhao Wanga, Mingyu Li, Evolution of the bulk microstructure in 1100 aluminum builds fabricated by ultrasonic metal welding. Journal of Materials Processing Technology 2014, 214: 175-182.
Hongjun Ji, Shuai Wang, MingyuLi, Jongmyung Kim. Deep crystallization induced high thermal conductivity of low-temperature sintered Ag nanoparticles. Materials Letters 2014, 116: 219-222.
Hongjun Ji, Qiang Wang, Mingyu Li, Chunqing Wang.Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted Solidification.Journal of Electronic Materials 2014, 43: 2467-2478.
YongXiao, HongjunJi, MingyuLi, Jongmyung Kim. Ultrasound-induced equiaxial ower-like CuZn5/Al composite microstructure formation in Al/Zn–Al/Cu joint. Materials Science & Engineering A 2014, 594: 135-139.
Hongjun Ji, Qiang Wang, Mingyu Li, Chunqing Wang. Effects of ultrasonic irradiation and cooling rate on the solidification microstructure of Sn–3.0Ag–0.5Cu alloy. Journal of Materials Processing Technology 2014, 214: 13-20.
Yong Xiao, Hongjun Ji, Mingyu Li, Jongmyung Kim. Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn-3Al filler metal. Materials & Design 2013, 52: 740-747.
Shuai Wang, Mingyu Li, Hongjun Ji. Chunqing Wang. Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging. Scripta Materialia 2013, 69: 789-792.
Yong Xiao, Hongjun Ji, Mingyu Lia, etc. Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn–Al hypereutectic filler metal. Materials & Design 2013, 47: 717–724.
Hongjun Ji, Mingyu Li, Yongfei Lu, Chunqing Wang. Mechanical properties and microstructures of hybrid ultrasonic resistance brazing of WC-Co/BeCu, Journal of Materials Processing Technology, 2012, 212:1885-1891.
Shuai Wang, Hongjun Ji, Mingyu Li, Chunqing Wang, Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles, Materials Letters, 2012, 85:61-63.
Hongjun Ji, Mingyu Li, etc, In situ Measurement of Bond Resistance Varying with Process Parameters during Ultrasonic Wedge Bonding. Journal of Materials Processing Technology, 2009, 209(1): 139-144.
Hongjun Ji, Mingyu Li, etc, Nano Features of Al/Au Ultrasonic Bond Interface Observed by High Resolution Transmission Electron Microscope. Materials Characterization. 2008, 59: 1419-1424.
Heeseon Bang, Hongjun Ji, Mingyu Li, etc. Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-off Method. Materials Science Forum. 2008, 580-582: 173-176.
Hongjun Ji, Mingyu Li, Chunqing Wang, etc. Comparison of Interface Evolution of Ultrasonic Aluminum and Gold Wire Wedge Bonds during Thermal Aging. Materials Science & Engineering A, 2007,447 (1-2): 111-118.
Hongjun Ji, Mingyu Li, Chunqing Wang, etc. Evolution of the Bond Interface during Ultrasonic Al–Si Wire Wedge Bonding Process. Journal of Materials Processing Technology, 2007,182 (1-3):202-206.
Mingyu Li , Hongjun Ji, Chunqing Wang, etc. Interdiffusion of Al–Ni System Enhanced by Ultrasonic Vibration at Ambient Temperature. Ultrasonics. 2006, 45(1-4): 61-65.
Mingyu Li, Hongjun Ji, Chunqing Wang, etc. Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding. Jounal of Materials Science & Technology 2006, 22(4): 483-486.
会议论文及发表演说
Pan Hao, Ji Hongjun, Microstructure Evolution of Sn10Sb/Kovar Under Reflow and Ultrasonic Treatment, IIW 2022 Annual Assembly and International Conference, Tokyo, Japan, July 17-22, 2022. (Oral)
计红军，大功率电子器件封装中超声互连冶金现象，IFAM2021 新材料国际发展趋势高层论坛，宁波，2021年10月16-18日（邀请报告）
计红军，面向芯片封装的功率超声微纳连接技术，IFAM2020 新材料国际发展趋势高层论坛，西安，2020年10月30-11月1日（邀请报告）
计红军，电子制造中超声连接技术研究进展，异质材料焊接与连接先进技术研究应用发展论坛，兰州，2020 年 9 月 24-26 日（邀请报告）
Zhang Lin, Yu Jiaao, Zhao Changyao, Li Mingyu, Ji Hongjun, Study on Water Bath Pulling Method Mechanism for Implementing the Equidistant Arrangement of - Ag NWs on Flexible Substrate, IEEE 2020 International Conference on Electronic Packaging Technology, Hongkong, China, Aug.12-15, 2020.（Oral）
Zhang Wenwu, Cao Yichen, Zhang Lin, Ji Hongjun, Li Mingyu, Enhanced antioxidant and size controllable Cu@Ag core-shell nanoparticles conductive inks for flexible printed electronics, IEEE 2020 International Conference on Electronic Packaging Technology, Hongkong, China, Aug.12-15, 2020.（Oral）
Hongjun Ji, Ultrasonic-assisted sintering of Cu@Ag NPs nanoparticles in air for high-temperature power device packaging. IEEE Nano, Macau, China, July 22-26, 2019. （Invited）
Hongjun Ji, Hao Pan, Mingyu Li, A high-efficiency method to fabricate high-melting-point joints by ultrasonic for high-temperature power device packaging, 4th Asia-Oceania Sonochemical Society Conference, Nanjing, China, Sep. 19-21, 2019.（Poster)
Wenwu Zhang, Hongjun Ji*, A green sonochemical synthesis of highly efficient, large scale, size-controlled, air-stable, and monodispersed copper@silver core-shell nanoparticles for flexible electronics, 4th Asia-Oceania Sonochemical Society Conference, Nanjing, China, Sep. 19-21, 2019.（Oral）
Hongjun Ji, Mingyu Li, Weiwei Zhao, Ultrasonic-accelerated intermetallic joint formation with composite solder for high-temperature power device packaging. ECTC, Las Vegas, NV, USA, May 28-31, 2019.（Oral）
计红军，超声波连接技术进展及其在精密电子制造中的应用，中国焊接机器人发展论坛，Changzhou, China, July 26-27, 2018（邀请报告）
计红军，超声技术在先进焊接和连接中的应用和最新进展，IFWT2018焊接国际论坛，Dongguan, China, May 9th, 2018（邀请报告）
Hongjun Ji, Mingyu Li. Ultrasonic-assisted sintering of Cu@Ag nanoparticles paste in air for chip attachment.4th International Conference on Nanojoining and microjoining, Nara, Japan, Dec. 2-5, 2018.（Oral）
Jiayi Huang, Hongjun Ji*, Hao Pan, Fanqi Yin, Hao Liu, Jiaao Yu, Mingyu Li.Mechanism of Ni3Sn4 rapid formation of Sn-Ni mixed particles paste in ultrasound-assisted TLP for power electronic chip attachment. IEEE 2018 International Conference on Electronic Packaging Technology, Shanghai, China, Aug.8-11, 2018.（Oral）
Hongjun Ji, Mingyu Li. Mechanism of ultrasonic-assisted sintering of Cu@Ag NPs paste in air for high-temperature power device packaging. ECTC, San Diego, California,USA, May 29-June 1, 2018.（Oral）
Hongjun Ji, Mingyu Li. Mechanism of ultrasonic-assisted sintering of Cu@Ag NPs paste in air for high-temperature power device packaging. The 7th East Asia Symposium on Technology of Welding and Joining (7th EAST-WJ), Hangzhou, China, Oct. 31 - Nov.1, 2017.（Oral）
Hongjun Ji, Mingyu Li. Rapid formation of intermetallic joint during ultrasonic assisted soldering of Sn-based composite solders. 2017 Materials Science and Technology (MS&T17), Pittsburgh, Pennsylvania, USA, Oct. 8-12, 2017.（Oral）
Shu Ma, Hongjun Ji*, Junbo Zhou, Huajun Lu, Meng Liang, Minggang Li, Mingyu Li.Rapid Formation of Intermetallic Joints with Sn/Metal Composite Alloys by Ultrasonic-assisted Soldering for High-temperature Chip Attachment. IEEE 2017 International Conference on Electronic Packaging Technology, Harbin, China, Aug.16-19, 2017.（Oral）
Hongjun Ji, Mingyu Li. Ultrasonic-induced intermetallic joint with Sn-based solders for high-temperature high-power device packaging. 70th IIW Annual Assembly & International Conference, Shanghai, China, June 25-30, 2017.（Oral）
Hongjun Ji, Mingyu Li. Mechanism for Rapid Intermetallic Joint Formation during Ultrasonic-assisted Soldering of Sn-based Composite Solders, International Welding/Joining Conference-Korea (IWJC-Korea 2017), HICO, Gyeongju, South Korea, April 11-14, 2017.（Oral）
Hongjun Ji, Minggang Li, Mingyu Li. Ultrasonic-assisted soldering of Sn/Ni composite solder during die bonding for high-temperature application. IEEE 2016 International Conference on Electronic Packaging Technology, Wuhan, China, Aug.16-19, 2016. (Poster)
Hongjun Ji, Mingyu Li, Yunfei Qiao. Ultrasonic-assisted soldering of Sn-based solder alloys to form intermetallic interconnects for high temperature application. ECTC, Las Vegas, NV, USA, May 31-June 3, 2016.（Oral）
Hongjun Ji. Effects of Ultrasonic Vibration on Undercooling and Microstructures of SAC305 Alloy Solder Joints. 2015 Materials Science and Technology (MS&T15), Columbus, OH, USA, Oct. 4-8, 2015.（Oral）
Hongjun Ji, Yunfei Qiao, Mingyu Li. Ultrasonic-assisted soldering of Sn-based alloys during die bonding for high-temperature application. IEEE 2015 International Conference on Electronic Packaging Technology, Changsha, China, Aug.11-14, 2015.（Oral）
Hongjun Ji, Mingyu Li. Progress in ultrasonic-assisted soldering/brazing for joining hard wetted materials. The Fifth East Asia Symposium of Welding and Joining (5th EAST-WJ), Hokkaido, Japan, Sep. 2-3, 2015.（Oral）
Hongjun Ji, Hao Chen, Mingyu Li. Microstructures and properties of alumina/copper joints fabricated by ultrasonic-assisted brazing for replacing DBC in power electronics packaging, IEEE 2014 International Conference on Electronic Packaging Technology, Chengdu, China, Aug.12-15, 2014.（Oral）
Hongjun Ji, Long Li, Lijie Wang, Mingyu Li. Microstructures and Properties of the Fe-based Amorphous Foil/Aluminum Dissimilar Joint by Ultrasonic-assisted soldering. International Conference on Brazing, Soldering and Special Joining Technologies, Beijing, China, June 9-13, 2014.（Oral）
Hongjun Ji, Mingyu Li. Effect of Silver Content in SAC Solder on the Interfacial Reaction and Reliability of the Angle Joints Fabricated by Laser-jet Soldering. 2014 TMS Annual Meeting & Exhibition, SanDiego, FL, US, Feb. 16-20, 2014.（Oral）
Hongjun Ji, Xiao Cheng, Hao Chen, et al. Direct Bonding of Alumina Substrate with Copper Heat Sink in Air Assisted by Ultrasonic vibrations for High Power LEDs Devices. IEEE 2013 International Conference on Electronic Packaging Technology, Dalian, China, Aug.11-14, 2013.（Poster)
Shuai Wang, Hongjun Ji, Mingyu Li, et al. Pressureless low temperature sintering of Ag nanoparticles for interconnects. 2012 14th International Conference on Electronic Materials and Packaging, HongKong, Dec. 12-16, 2012. （Oral）
Hongjun Ji, Junzhao Wang, Mingyu Li. Microstructure evolution of 1100 Al alloy multi-foils during ultrasonic additive manufacturing. IEEE 2012 International Conference on Electronic Packaging Technology, Guilin, China, Aug.13-16, 2012.（Poster)
Hongjun Ji, Qiang Wang, Mingyu Li. Effects of ultrasonic vibrations on undercooling and microstructures. IEEE 2012 International Conference on Electronic Packaging Technology, Guilin, China, Aug.13-16, 2012.（Oral）
Hongjun Ji, Mingyu Li, Chunqing Wang. Ultrasonic-induced deformation nanostructures in coarse-grained aluminum wires at room termperature. IEEE 2012 International Conference on Electronic Packaging Technology, Guilin, China, Aug.13-16, 2012.（Oral）
Hongjun Ji, Masahiko Demura, etc. Diffusion Bonding of Boron-free Ni3Al Foils without Interlayer. The 2009 Autumn Meeting of The Japan Institute of Metals, University of Kyoto, Kyoto, Japan, 2009.（Oral）
Hongjun Ji, Mingyu Li, Chunqing Wang, etc. Nanoscale Analysis of Ultrasonic Wedge Bond Interface by Using High-Resolution Transmission Electron Microscopy. IEEE 2008 International Conference on Electronic Packaging Technology & High Density Packaging,Shanghai, China, Aug. 28-31, 2008.（Oral, Best paper)
Hongjun Ji, Mingyu Li, etc. Observation of Ultrasonic Al-Si Wire Wedge Bond Interface Using High Resolution Transmission Electron Microscope. IEEE 2007 8th International Conference on Electronic Packaging Technology, Shanghai, China, Aug.15-17, 2007. （Oral）
Han Sur Bang, Hongjun Ji, Mingyu Li, Chunqing Wang. Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-off Method. International Welding/Joining Conference-Korea 2007, Seoul, Korea, May 10-12, 2007.
Mingyu Li, Hongjun Ji, Chunqing Wang. Comparison of Bond Interface Reaction in Al-Ni and Al-Au Systems Formed by Ultrasonic Wedge Bonding. 8th International Conference on Electronic Materials and Packaging, Hong Kong, China, Dec. 11-14, 2006.
Hongjun Ji, Mingyu Li, Chunqing Wang. Interfacial Characterization and Bonding Mechanism of Ultrasonic Wedge Bonding. IEEE 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug.26-29, 2006: 457-46.（Oral）
Mingyu Li, Song Li, Hongjun Ji. Metallurgical Behavior of Au/Al Bond Interface during High Temperature Storage of Ultrasonic Wedge Bonding. IEEE 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug.26-29, 2006: 641-644.
Mingyu Li, Jingwei Guan, Hongjun Ji. Study on Optimized Processing Parameters and Joint Resistance of Device during Ultrasonic Bonding. IEEE 2006 7th International Conference on Electronic Packaging Technology, Shanghai, China, Aug.26-29, 2006: 280-282.
Ji Hongjun, Li Mingyu, Wang Chunqing. The Diffusion of Ni into Al Wire at the Interface of Ultrasonic Wire Bond during High Temperature Storage. IEEE 2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China, Aug.31-Sep.2, 2005: 377-381. （Oral）
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