安茂忠 - 哈尔滨工业大学 - 化工与化学学院

个人简介

安茂忠，男，汉族，1962年生。教授，博士生导师；哈尔滨工业大学化工学院应用化学系主任。先后主持过国家级科技项目3项、省部级科技项目5项，主持横向科研项目10余项。在国内外学术期刊上发表学术论文240余篇，其中被SCI、EI收录90余篇；主编教材、专著各1部，参编专著4部；获得授权国家发明专利15项。多次应邀在国际、全国性学术会议上做报告。曾获得黑龙江省技术发明一等奖1项(排名第1)、自然一等奖1项(排名第2)，国防科技进步三等奖2项（分别排名第2、第3），其他省部级科技进步二等奖5项、三等奖3项。教育经历 1979年-1983年, 就读于哈尔滨工业大学电化学工程专业, 获得工学学士学位 1983年-1986年, 就读于哈尔滨工业大学应用电化学学科, 获得工学硕士学位 1994年-1999年, 就读于哈尔滨工业大学材料化学与物理学科, 获得工学博士学位工作经历 2001年 4 月~至今哈尔滨工业大学应用化学学科博士生导师 2000年 8 月~2001年 4 月哈尔滨工业大学电化学教研室教授 1993年10月~2000年 7 月哈尔滨工业大学电化学教研室副教授 1988年10月~1993年 9 月哈尔滨工业大学电化学教研室讲师

研究领域

长期从事应用电化学方面的研究工作。主要包括：电镀合金镀层的工艺研究、电沉积机理研究、镀层耐蚀性能研究等；化学镀工艺与理论研究；轻金属的氧化与着色工艺与理论研究；钢铁的磷化工艺研究；电沉积新型功能材料；电镀层性能表征；电镀生产线设计与控制系统研制；电沉积方法制备微纳米薄膜工艺与理论研究；电化学微纳米加工技术研究等

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Ji S S, Lian Y, Zhang J, Yang P X, Zhang J Q, An M Z*. Electrodeposition of CuInxGa1-xSe2 thin films via pulse technique from Ionic liquid containing n-propyl alcohol. Materials Letters, 161: 411-414, 2015 Ren X F, Song Y, Liu A M, Zhang J, Yuan G H, Yang P X, Zhang J Q, An M Z*, Matera D, Wu G. Computational Chemistry and Electrochemical Studies of Adsorption Behavior of Organic Additives during Gold Deposition in Cyanide-free Electrolytes. Electrochimica Acta, 176: 10-17, 2015 Feng Z B, Li Q Y, Zhang J Q, Yang P X, Song H L, An M Z*. Electrodeposition of nanocrystalline Zn-Ni coatings with single gamma phase from an alkaline bath, Surface & Coatings Technology, 270: 47-56, 2015 Liu L L, An M Z*, Yang P X, Zhang J Q. Superior cycle performance and high reversible capacity of SnO2/graphene composite as an anode material for lithium-ion batteries. Scientific Reports, 5: 9055, 2015 Li Q Y, Ge W, Zhang J Q, Yang P X, An M Z*. Synergistic effects of passivation treatment and nano-electrodeposition technologies on corrosion protection performance of the electrogalvanized steel. New Journal of Chemistry, 39(12): 9903-9909, 2015 Feng Z B, Li Q Y, Zhang J Q, Yang P X, An M Z*. Electrochemical Behaviors and Properties of Zn-Ni Alloys Obtained from Alkaline Non-Cyanide Bath Using 5,5 '-Dimethylhydantoin as Complexing Agent. Journal of the Electrochemical Society, 162(9): D412-D422, 2015 Ren X F, Song Y, Liu A M, Zhang J, Yang P X, Zhang J Q, Yuan G H, An M Z*, Osgood H, Wu G. Role of polyethyleneimine as an additive in cyanide-free electrolytes for gold electrodeposition. RSC Advances, 5(79): 64806-64813, 2015 Ren X F, Song Y, Liu A M, Zhang J, Yang P X, Zhang J Q, Yuan G H, An M Z*. Experimental and theoretical studies of DMH as a complexing agent for a cyanide-free gold electroplating electrolyte. RSC Advances, 5(80): 64997-65004, 2015 Feng Z B, Li Q Y, Zhang J Q, Yang P X, An M Z. Studies on the enhanced properties of nanocrystalline Zn-Ni coatings from a new alkaline bath due to electrolyte additives RSC A dvances, 5(72): 58199-58210, 2015 Li Q Y, Feng Z B, Liu L H, Xu H, Ge W, Li F H, An M Z*. Deciphering the formation mechanism of a protective corrosion product layer from electrochemical and natural corrosion behaviors of a nanocrystalline zinc coating. RSC Advances, 5(41): 32479-32490, 2015 Liu A M, Ren X F, Zhang J, Yuan G H, Yang P X, Zhang J Q, An M Z*. A composite additive used for an excellent new cyanide-free silver plating bath. New Journal of Chemistry, 39(4): 2409-2412, 2015 Li Q Y, Feng Z B, Liu L H, Sun J, Qu Y T, Li F H, An M Z*. Research on the tribological behavior of a nanocrystalline zinc coating prepared by pulse reverse electrodeposition. RSC Advances, 5(16): 12025-12033, 2015 Ji S S, Yang P X, Zhang J Q, Lian Y, Zhang J, An M Z. Electrodeposition of CuInxGa1-xSe2 from a 1-butyl-3-methylimidazolium trifluoromethanesulfonate ionic liquid. Materials Letters, 133: 14-16, 2014 Yan B, Zhang J Q, Yang P X, An M Z. Effect of 2-Butyne-1,4-diol and Ethylene Diamine on Electrodeposition of Cu from Ionic Liquid. Chinese Journal of Inorganic Chemistry, 30(4): 952-960, 2014 Ji S S, Mei Y X, Zhang J Q, Yang P X, Lian Y, An M Z. Fabrication of CuInxGa1-xSe2 Thin Films via Electrodeposition Method with Ionic Liquid Electrolytes. Chinese Journal of Inorganic Chemistry, 30(2): 466-472, 2014 Liu A M, Ren X F, An M Z, Zhang J Q, Yang P X, Wang B, Zhu Y M, Wang C. A Combined Theoretical and Experimental Study for Silver Electroplating. Scientific Reports, 4: 3837, 2014 Liu A M, Ren X F, Zhang J, Wang C, Yang P X, Zhang J Q, An M Z, Higgins D, Li Q, Wu G. Theoretical and experimental studies of the corrosion inhibition effect of nitrotetrazolium blue chloride on copper in 0.1M H2SO4. RSC Advances, 4(76): 40606-40616, 2014 Liu A M, Ren X F, Wang B, Zhang J, Yang P X, Zhang J Q, An M Z. Complexing agent study via computational chemistry for environmentally friendly silver electrodeposition and the application of a silver deposit. RSC Advances, 4(77): 40930-40940, 2014 Zhang J, Liu A M, Ren X F, Zhang J Q, Yang P X, An M Z. Electrodeposit copper from alkaline cyanide-free baths containing 5,5 '-dimethylhydantoin and citrate as complexing agents. RSC Advances, 4(72): 38012-38026, 2014 Li X Y, Zhang J Q, Yang P X, An M Z. A study of electrodepositing Sn-SiC composite coatings with good welding performances. RSC Advances, 4(12): 5853-5859, 2014 Wang C, Zhang J Q, Yang P X, An M Z*. Electrochemical behaviors of Janus Green B in through-hole copper electroplating: An insight by experiment and density functional theory calculation using Safranine T as a comparison. Electrochimica Acta, 92: 356-364, 2013 Wang C, Zhang J Q, Yang P X, Zhang B Q, An M Z*. Through-Hole Copper Electroplating Using Nitrotetrazolium Blue Chloride as a Leveler. Journal of The Electrochemical Society, 160(3): D1-D4, 2013 Yang P X, Zhao Y B, Su C N, Yang K J, Yan B, An M Z*. Electrodeposition of Cu-Li alloy from room temperature ionic liquid 1-butyl-3-methylimidazolium tetrafluoroborate. Electrochimica Acta, 88: 203-207, 2013 任雪峰，杨培霞，刘安敏，安茂忠*. 代铬镀层的研究进展. 化学通报，76(1)： 39-45，2013 Yan B, Zhang J Q, Yang P X, An M Z*. Electrochemical Induced Codeposition of Li with Cu from 1-Hexyl-3-Methylimidazolium Trifluoromethanesulfonate Ionic Liquid. International Journal of Electrochemical Science, 7(12): 12846-12855, 2012 Wang C, Zhang J Q Yang P X, An M Z*. Through-Hole Filling by Copper Electroplating Using Sodium Thiazolinyl-Dithiopropane Sulfonate as the Single Additive. International Journal of Electrochemical Science, 7(11): 10644-10651, 2012 Yan B, Yang P X, Zhao Y B, Zhang J Q, An M Z*. Electrocodeposition of lithium and copper from room temperature ionic liquid 1-ethyl-3-methyllimidazolium bis (trifluoromethylsulfonyl)imide. RSC Advances, 2(33): 12926-12931, 2012 Wang C, An M Z*, Yang P X, Zhang J Q. Prediction of a new leveler (N-butyl-methyl piperidinium bromide) for through-hole electroplating using molecular dynamics simulations. Electrochemistry Communications, 18: 104-107, 2012 崔莹，杨培霞，刘磊，曾鑫，郭伟荣，项昕，安茂忠*. 电沉积Ni-Co-B 纳米晶合金代硬铬镀层. 中国有色金属学报，22(11): 3114-3122，2012 杨潇薇, 安茂忠*, 张云望, 张林. DMDMH 镀液体系中金的电沉积. 无机化学学报, 28(6): 1145-1150, 2012 杨潇薇，安茂忠*，张云望，张林. DMH镀金体系在ICF空腔靶中的应用. 强激光与离子束，24(5): 1111-1116，2012 Yang X W, An M Z*, Zhang Y W, Yang P X, Zhang J Q. Electrochemical behavior of gold(III) in cyanide-free bath with 5,5'-dimethylhydantoin as complexing agent. Electrochimica Acta, 58: 516-522, 2011 Cui W Y, An M Z*, Yang P X, Zhang J Q. Cathodic and Thermal Stabilities of the P(VdF-HFP)-Based Ionic Liquid Composite Polymer Electrolyte. Acta Physico-Chimica Sinica, 27(1): 78-84, 2011 Cui W Y，An M Z*，Yang P X，Zhang J Q，Sun X B. Vinylene carbonate additive for EMITFSI-based electrolyte for Li/LiFePO4 batteries. Journal of Harbin Institute of Technology, 18(5): 44-48, 2011