高立明 - 上海交通大学 - 材料科学与工程学院

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研究领域

研究方向一微电子技术研究方向二集成电路制造及可靠性分析

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近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

L. Gao, C. Burmer: PLL soft functional failure analysis in advanced logic product using fault based analogue simulation and soft defect localization. Microelectronics Reliability 48 (2008) 1349-1353. L. Gao, C. Burmer and F. Siegelin: ATPG scan logic failure analysis: a case study of logic ICs: fault isolation, defect mechanism identification and yield improvement. Microelectronics Reliability 46 (2006) 1458-1463., L. Gao, P. Haerter, Ch. Linsmeier, A. Wiltner, R. Emling and D. Schmitt-Landsiedel: Silver metal organic chemical vapor deposition for advanced silver metallization. Microelectronic Engineering 82 (2005) 296-300. L. Gao, P. Haerter, Ch. Linsmeier, J. Gstoettner, R. Emling and D. Schmitt-Landsiedel: Metalorganic Chemical Vapor Deposition of Silver Thin Films for Future Interconnects by Direct Liquid Injection System. Materials Science in Semiconductor Processing, Vol. 7, 2004, 331-335 , L. Gao, J. Gstoettner, R. Emling, M. Balden, Ch. Linsmeier, A. Wiltner, W. Hansch, and D. Schmitt-Landsiedel: Thermal stability of titanium nitride diffusion barrier films for advanced silver interconnects. Microelectronic Engineering, 76 (2004) 76-81.

近期论文

L. Gao, C. Burmer: PLL soft functional failure analysis in advanced logic product using fault based analogue simulation and soft defect localization. Microelectronics Reliability 48 (2008) 1349-1353.

L. Gao, C. Burmer and F. Siegelin: ATPG scan logic failure analysis: a case study of logic ICs: fault isolation, defect mechanism identification and yield improvement. Microelectronics Reliability 46 (2006) 1458-1463.,

L. Gao, P. Haerter, Ch. Linsmeier, A. Wiltner, R. Emling and D. Schmitt-Landsiedel: Silver metal organic chemical vapor deposition for advanced silver metallization. Microelectronic Engineering 82 (2005) 296-300.

L. Gao, P. Haerter, Ch. Linsmeier, J. Gstoettner, R. Emling and D. Schmitt-Landsiedel: Metalorganic Chemical Vapor Deposition of Silver Thin Films for Future Interconnects by Direct Liquid Injection System. Materials Science in Semiconductor Processing, Vol. 7, 2004, 331-335 ,

L. Gao, J. Gstoettner, R. Emling, M. Balden, Ch. Linsmeier, A. Wiltner, W. Hansch, and D. Schmitt-Landsiedel: Thermal stability of titanium nitride diffusion barrier films for advanced silver interconnects. Microelectronic Engineering, 76 (2004) 76-81.