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2. 张俊;  Vallée, R. A. L.;  Kochovski, Z.;  Zhang, W.;  Shen, C.;  Bertram, F.; Pinna, N., Self-assembly Mechanism and Chiral Transfer in CuO Superstructures. Angewandte Chemie International Edition 2023, 62 (27), e202305353. 

3. 张俊;  Zhang, H.;  Cao, W.;  Pang, Z.;  Li, J.;  Shu, Y.;  Zhu, C.;  Kong, X.;  Wang, L.; Peng, X., Identification of Facet-Dependent Coordination Structures of Carboxylate Ligands on CdSe Nanocrystals. Journal of the American Chemical Society 2019, 141 (39), 15675-15683. 

4. 张俊;  Werner, S.;  Köppen, A.;  Liu, X.;  Shen, C.;  Bertram, F.;  Parak, W. J.; Sun, X., Unraveling the synthesis and assembly of gold-iron oxide hybrid nanoparticles. Nano Today 2024, 57, 102384. 中文介绍

5. 张俊;  Xing, T.;  Zhang, M.; Zhou, Y., Facile preparation of Cu2-xS supernanoparticles with an unambiguous SERS enhancement mechanism. Chemical Engineering Journal 2022, 434, 134457. 

6. Pang, Z.;  张俊(共一);  Cao, W.;  Kong, X.; Peng, X., Partitioning surface ligands on nanocrystals for maximal solubility. Nature Communications 2019, 10 (1), 2454. 

7. 张俊;  Tian, F.;  Zhang, M.;  Li, T.;  Kong, X.;  Zhou, Y.; Kotov, N. A., Nonsolvent induced reconfigurable bonding configurations of ligands in nanoparticle purification. Nanoscale Horizons 2019, 4 (6), 1416-1424.

8. 张俊;  Khuje, S.;  Sun, X.;  Wang, Z.;  Keitz, S.; Yu, J.;  Ren, S., Metal-organic Decomposition for Additive Manufacturing of Extreme Environment Electronics. ACS Applied Materials & Interfaces，2025

9.  Li, Z.;  Ge, X.; Rumsey, CL.;  张俊(共一);  Feng, Q.; Wang, Z.; Khuje, S.; Ren, S.,  Three-Dimensional Porous Copper Conductive Paper. Nano letter, 2025