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Manufacturing is undergoing major transformation due to the unforeseen challenges arising from the current trend of miniaturization, the emergence of new materials and the growing interaction between biologists and engineers to learn more from nature and living objects.
Traditionally, a "top-down" approach has been used in manufacturing. Recently, engineers and scientists have begun exploring "bottom-up" approaches for manufacturing today's highly complex products. Further, these emerging processes are aimed to improve process efficiency and product quality.
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
Papers relevant to the scope of JMP include, but are not limited to, the following areas:
• Meso/micro/nano fabrication, including imprint lithography. • Advanced manufacturing processes, including mechanical, chemical and thermal processes. • Welding, joining and assembly at micro and macro scales. • Rapid prototyping, rapid manufacturing and repair, stereolithography and other 3-D fabrication techniques that can use optical projection. • Advanced embossing, casting, forming and molding processes at all scales. • Continuum and subcontinuum process modeling and simulation. • Manufacturing process monitoring, control and automation. • Tribology and wear issues relevant to manufacturing processes.
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编辑信息 |
Editor-in-Chief University of Illinois at Urbana-Champaign, Champaign, Illinois, United States Email S. Kapoor Associate Editors G. ChengPurdue University, West Lafayette, Indiana, United StatesUniversity of Louisville, Louisville, Kentucky, United States H. ChungMichigan State University, East Lansing, Michigan, United StatesJ. DongNorth Carolina State University, Raleigh, North Carolina, United StatesA. ElwanyTexas A&M University College Station, College Station, Texas, United StatesP. GuoNorthwestern University, Evanston, Illinois, United StatesM. B. JunPurdue University, West Lafayette, Indiana, United StatesA.S KumarNational University of Singapore, Singapore, SingaporePennsylvania State University, University Park, Pennsylvania, United States J. MaSaint Louis University, Saint Louis, Missouri, United StatesA.S. MalikUniversity of Texas at Dallas, Richardson, Texas, United StatesC. NathHitachi Automotive Systems Americas Inc, Farmington Hills, Michigan, United StatesG. NgaileNorth Carolina State University, Raleigh, North Carolina, United StatesC. NikhareThe Pennsylvania State University Erie The Behrend College, Erie, Pennsylvania, United StatesS.S. ParkUniversity of Calgary, Calgary, Alberta, CanadaJ. SamuelRensselaer Polytechnic Institute, Troy, New York, United StatesM. StranoPolytechnic University of Milan, Milano, ItalyM. SundaramUniversity of Cincinnati, Cincinnati, Ohio, United StatesTechnical University of Denmark Department of Mechanical Engineering, Kongens Lyngby, Denmark B. WuPurdue University, West Lafayette, Indiana, United StatesH. Yamaguchi GreensletUniversity of Florida, Gainesville, Florida, United StatesF. YangUniversity of Kentucky, Lexington, Kentucky, United StatesY. ZhangUniversity of Kentucky, Lexington, Kentucky, United States
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