Manufacturing is undergoing major transformation due to the unforeseen challenges arising from the current trend of miniaturization, the emergence of new materials and the growing interaction between biologists and engineers to learn more from nature and living objects. 

Traditionally, a "top-down" approach has been used in manufacturing. Recently, engineers and scientists have begun exploring "bottom-up" approaches for manufacturing today's highly complex products. Further, these emerging processes are aimed to improve process efficiency and product quality. 

The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published. 

Papers relevant to the scope of JMP include, but are not limited to, the following areas:


• Meso/micro/nano fabrication, including imprint lithography. 
• Advanced manufacturing processes, including mechanical, chemical and thermal processes. 
• Welding, joining and assembly at micro and macro scales. 
• Rapid prototyping, rapid manufacturing and repair, stereolithography and other 3-D fabrication techniques that can use optical projection. 
• Advanced embossing, casting, forming and molding processes at all scales. 
• Continuum and subcontinuum process modeling and simulation. 
• Manufacturing process monitoring, control and automation. 
• Tribology and wear issues relevant to manufacturing processes. 

original technical papers 

Editor-in-Chief
S. Kapoor
University of Illinois at Urbana-Champaign, Champaign, Illinois, United States Email S. Kapoor
Associate Editors
M. Annoni, MSME
Polytechnic University of Milan, Milano, Italy
G. Cheng
Purdue University, West Lafayette, Indiana, United States
K. Chou
University of Louisville, Louisville, Kentucky, United States
H. Chung
Michigan State University, East Lansing, Michigan, United States
J. Dong
North Carolina State University, Raleigh, North Carolina, United States
A. Elwany
Texas A&M University College Station, College Station, Texas, United States
P. Guo
Northwestern University, Evanston, Illinois, United States
M. B. Jun
Purdue University, West Lafayette, Indiana, United States
A.S Kumar
National University of Singapore, Singapore, Singapore
J.J Li
Pennsylvania State University, University Park, Pennsylvania, United States
J. Ma
Saint Louis University, Saint Louis, Missouri, United States
A.S. Malik
University of Texas at Dallas, Richardson, Texas, United States
C. Nath
Hitachi Automotive Systems Americas Inc, Farmington Hills, Michigan, United States
G. Ngaile
North Carolina State University, Raleigh, North Carolina, United States
C. Nikhare
The Pennsylvania State University Erie The Behrend College, Erie, Pennsylvania, United States
S.S. Park
University of Calgary, Calgary, Alberta, Canada
J. Samuel
Rensselaer Polytechnic Institute, Troy, New York, United States
M. Strano
Polytechnic University of Milan, Milano, Italy
M. Sundaram
University of Cincinnati, Cincinnati, Ohio, United States
G. Tosello
Technical University of Denmark Department of Mechanical Engineering, Kongens Lyngby, Denmark
B. Wu
Purdue University, West Lafayette, Indiana, United States
H. Yamaguchi Greenslet
University of Florida, Gainesville, Florida, United States
F. Yang
University of Kentucky, Lexington, Kentucky, United States
Y. Zhang
University of Kentucky, Lexington, Kentucky, United States