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International Journal of Mechanics and Materials in Design
基本信息
期刊名称 International Journal of Mechanics and Materials in Design
INT J MECH MATER DES
期刊ISSN 1569-1713
期刊官方网站 http://www.springer.com/engineering/mechanics/journal/10999
是否OA
出版商 Springer Netherlands
出版周期
始发年份
年文章数 41
最新影响因子 3.7(2022)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 ENGINEERING, MECHANICAL 工程:机械3区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合3区
MECHANICS 力学2区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 3.04 0.903 1.222
Engineering
Mechanics of Materials
69 / 352 80%
Engineering
Industrial and Manufacturing Engineering
90 / 579 84%
Materials Science
General Materials Science
102 / 439 76%
补充信息
自引率 14.10%
H-index 19
SCI收录状况 Science Citation Index Expanded
官方审稿时间
网友分享审稿时间 数据统计中,敬请期待。
PubMed Central (PML) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1569-1713%5BISSN%5D
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期刊投稿网址 https://www.editorialmanager.com/mamd/default.aspx
收稿范围

It is the objective of this journal to provide an effective medium for the dissemination of recent advances and original works in mechanics and materials' engineering and their impact on the design process in an integrated, highly focused and coherent format. The goal is to enable mechanical, aeronautical, civil, automotive, biomedical, chemical and nuclear engineers, researchers and scientists to keep abreast of recent developments and exchange ideas on a number of topics relating to the use of mechanics and materials in design.

Analytical synopsis of contents:

The following non-exhaustive list is considered to be within the scope of the International Journal of Mechanics and Materials in Design:

Intelligent Design:

Nano-engineering and Nano-science in Design;
Smart Materials and Adaptive Structures in Design;
Mechanism(s) Design;
Design against Failure;
Design for Manufacturing;
Design of Ultralight Structures;
Design for a Clean Environment;
Impact and Crashworthiness;
Microelectronic Packaging Systems.

Advanced Materials in Design:

Newly Engineered Materials;
Smart Materials and Adaptive Structures;
Micromechanical Modelling of Composites;
Damage Characterisation of Advanced/Traditional Materials;
Alternative Use of Traditional Materials in Design;
Functionally Graded Materials;
Failure Analysis: Fatigue and Fracture;
Multiscale Modelling Concepts and Methodology;
Interfaces, interfacial properties and characterisation.

Design Analysis and Optimisation:

Shape and Topology Optimisation;
Structural Optimisation;
Optimisation Algorithms in Design;
Nonlinear Mechanics in Design;
Novel Numerical Tools in Design;
Geometric Modelling and CAD Tools in Design;
FEM, BEM and Hybrid Methods;
Integrated Computer Aided Design;
Computational Failure Analysis;
Coupled Thermo-Electro-Mechanical Designs.

Experimental Mechanics in Design:

Advanced Mechanical Testing in Design;
Non-destructive Tools in Design;
Condition Monitoring in Design;
Interferometry;
Photoelasticity and Strain Gauges in Design;
Quality Assurance and Control;
Intelligent Sensors in Design.

Design Case Studies:

Aeronautical and Automotive Engineering;
Mechanical Engineering;
Chemical Engineering;
Nuclear and Chemical Engineering;
Civil Engineering;
Bioengineering and Biotechnology.


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编辑信息

Editor-in-Chief

Shaker A. Meguid
Professor & Director 
Mechanics and Aerospace Design Laboratory
Mechanical and Industrial Engineering
University of Toronto, ON
Canada

Associate Editors

Professor Mario Guagliano
Milano Politecnico
Milano, Italy

Professor Manas Chandra Ray
Indian Institute of Technology Kharagpur
Kharagpur, India

Professor Chuanzeng Zhang
University of Siegen
Siegen, Germany

Editorial Board

K.J. Bathe, Massachusetts Institute of Technology (MIT), Cambridge, USA; J.L. Chenot, Ecole des Mines de Paris, Sophia Antipolis, France;George S. Dulikravich,Florida International University, Miami, FL, USA; Huajian GaoBrown University, Providence, RI, USA; J. Goldak, Carleton University, Ottawa, ON, Canada; Xu Han,Hunan University, Hunan, China;G.M. Hulbert, University of Michigan, Ann Arbor, MI, USA; I. Hutchings, University of Cambridge, UK; Radoslaw Iwankiewicz,Hamburg University of Technology, Hamburg, Germany; N. JonesUniversity of Liverpool, UK; Yang JuNagoya University, Nagoya, Japan;Alexander L. KalamkarovDalhousie University, Halifax, NS, Canada; H.W. KleinFH South Westphalia University of Applied Sciences, Meschede, Germany D.G. LeeKorea Advanced Institute of Science and Technology (KAIST), Daejon-Shi, Korea; S. Nemat-NasserUniversity of California at San Diego, La Jolla, USA; Sergio PellegrinoCalifornia Institute of Technology, Pasadena, CA, USA;J.N. Reddy, Texas A&M University, College Station, USA; T.Y. Ng, Nanyang Technological University, Singapore; K. TanakaNagoya University, Japan;K. WatanabeUniversity of Tokyo, Japan; G.J. WengState University of New Jersey, Piscataway, USA


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