Soldering & Surface Mount Technology (SSMT) seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
Among the range of topics covered are:

Soldering science and technology
Novel soldering processes and new solder alloys
Surface mount technology (SMT)
Surface mount assembly
Advanced packaging technologies and 3D interconnects
Flip chip/BGA/SiP/TSV
Novel substrates and embedded components
Solderable finishes and coatings
Screen printing
Conductive adhesives and conformal coatings
Reliability
Quality control
Inspection and testing
Rework and repair
Environmental aspects