Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.

Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
Additional regular features will include: 
• Special issues devoted to significant international conferences, or to important developing topics 
• Letters to the Editors 
• Industrial news and updates 
• Calendar of forthcoming events 
• Book reviews
Microelectronics Reliability is an indispensable forum for the exchange of knowledge and experience between microelectronics reliability professionals from both academic and industrial environments, and all those associated in any way with a steadily growing microelectronics industry and its many fields of application.

Original research papers, introductory invited and reviews papers, and research notes.

Editor-in-Chief
Dr. M. Tahoori
Karlsruhe Institute of Technology, Institute of Computer Engineering, Chair of Dependable Nano Computing, Technologiefabrik Haid-und-Neu-Str. 7 Build. 07.21, 3rd floor, D-76131, Karlsruhe, Germany, Fax: +49-721-608-43962 Phone +49-721-608-47778
Associate Editors
Dr. D. Agonafer
University of Texas at Arlington Electronics MEMS & Nanoelectronics Systems Packaging Center, 500 West First St, Rm 211A Woolf Hall, Arlington, Texas, TX 76019, United States, Fax: 817-272-5010 Phone 817-272-7377
Dr. D. Alexerdandrescu
Iroc Technologies SA, Grenoble, France
Dr. L. Anghel
Techniques of Informatics and Microelectronics for Integrated Systems Architecture Laboratory, 46, avenue Félix Viallet, 38031, Grenoble, France
Dr. H.A. Asadi
Sharif University of Technology Department of Computer Engineering, Azadi Ave, Tehran, Iran, Islamic Republic of
Dr. A.S. Bahman
Aalborg University Center of Reliable Power Electronics, Pontoppidanstraede 111, 9220, Aalborg, Denmark
Dr. P. Cova
University of Parma Department of Civil Environmental Land and Architecture Engineering, 43124, Parma, Italy, Fax: +39 0521 905822 Phone +39 0521 905818
Dr. H. Gossner
Intel Germany GmbH, Am Campeon 12, 85579, Neubiberg, Germany
Dr. P. Gromala
Robert Bosch GmbH Automotive Electronics, Postfach 13 42, 72703, Reutlingen, Germany
Dr. S. Hamdoui
Delft University of Technology Department of Materials Science and Engineering, Fac. 3ME, Mekelweg 2, Room 8D-4-07, 2628 CD, Delft, Netherlands
Dr. B. Han
University of Maryland at College Park Department of Mechanical Engineering, 2181 Glenn L. Martin Hall, Building 088, College Park, Maryland, 20742, United States, Fax: 301-314-9477 Phone 301-405-5255
Dr. J. Han
University of Alberta Department of Electrical and Computer Engineering, 9107 - 116 Street, Edmonton, T6G 2V4, Alberta, Canada
Dr. M. Hashimoto
Osaka University Graduate School of Information Science and Technology Information Systems Engineering, Toyonaka, Japan Phone +81-6-6879-4520
Dr. D. Huitink
University of Arkansas College of Engineering, 204 Mechanical Engineering Bldg, Fayetteville, Arkansas, 72701-4002, United States Phone 479-575-6263
Dr. F. Iannuzzo
Aalborg University, Center of Reliable Power Electronics (CORPE), Pontoppidanstraede 101, 9220, Aalborg Ø, Denmark Phone +39 0776 299 3741
Dr. P. Kuzhir
Belarusian State University Institute for Nuclear Problems, Bobruiskaya Str., 11, 220030, Minsk, Belarus Phone +375 29 605 18 35
Dr. D. Kwon
Sungkyunkwan University, Department of Systems Management Engineering, 27404B Sungkyunkwan University, Seobu-ro 2066, 16419, Jangan-gu, Suwon, Korea, Republic ofPhone +82-31-290-7593
Dr. C.-C. Lee
National Tsing Hua University Department of Power Mechanical Engineering, No. 101, Section 2, Kuang-Fu Road, 30013, Hsinchu, Taiwan Phone +886-3-5162410
Dr. E.A. Miranda
Autonomous University of Barcelona Electronic Engineering Department, Barcelona, Spain
Dr. W.H. Robinson
Vanderbilt University, PMB 351824, 2301 Vanderbilt Place, Nashville, Tennessee, 37235-1824, United States Phone (615) 322-1507
Dr. U. Schlichtmann
Technical University of Munich Department of Electrical and Computer Engineering, Theresienstr. 90, 80333, Munich, Germany Phone +49 (89) 289 - 23665
Dr. M. Shrivastava
Indian Institute of Science Department of Electronic Systems Engineering, Bangalore, India
Dr. C.-M. Tan
Chang Gung University, Dept. of Electronic Engineering, 259 Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan, Taiwan
Dr. S.X.-D. Tan
University of California Riverside Department of Electrical and Computer Engineering, Winston Chung Hall, Riverside, California, CA 92521, United States, Fax: +1 951-827-2425 Phone +1 951-827-5143
Dr. E.I. Vatajelu
Techniques of Informatics and Microelectronics for Integrated Systems Architecture Laboratory, 46, avenue Félix Viallet, 38031, Grenoble, France
Dr. H. Wang
Shanghai Advanced Research Institute, Rm 505, Building 1, 99 Haike Road, 201210, Shanghai, China Phone 8621-20325159
Former Editor-in-Chief
N.D. Stojadinovic
Founding Editor
G.W.A. Dummer
Editorial Advisory Board
M. Amagai
Texas Instruments Japan Ltd Oita, Oita, Japan
Y.C. Chan
City University of Hong Kong, Kowloon, Hong Kong
K. Croes
Interuniversity Micro-Electronic Centre, Leuven, Belgium
G. De Mey
Ghent University, Gent, Belgium
S. Dimitrijev
Griffith University, Nathan, Queensland, Australia
A. Dziedzic
Wroclaw University of Science and Technology, Wroclaw, Poland
D.M. Fleetwood
Vanderbilt University, Nashville, Tennessee, United States
D. Flores
National Centre of Microelectronics, Bellaterra, Spain
M. Fukuda
NTT Science and Core Technology Laboratory Group, Atsugi, Japan
R. Ghaffarian
California Institute of Technology, Pasadena, California, United States
G. Ghibaudo
Graduate School of Physics Electronics and Materials, Grenoble, France
T. Grasser
TU Wien University, Wien, Austria
V. Huard
STMicroelectronics, Genève, Switzerland
D. P. Ioannou
International Business Machines Corp
H. Iwai
Tokyo Institute of Technology - Suzukakedai Campus, Yokohama, Japan
N. Labat
Laboratory of Material System Integration, Talence Cedex, France
B. Li
IBM Essex Junction, Essex Junction, Vermont, United States
J. Liou
University of Central Florida, Orlando, Florida, United States
J. Lutz
Chemnitz University of Technology, Chemnitz, Germany
I. Manic
University of Niš, Nis, Serbia
R. Menozzi
University of Parma, Parma, Italy
E. Miranda
University of Buenos Aires, Buenos Aires, Argentina
H. Momose
Toshiba Corporation Research and Development Center, Isogo-Ku, Yokohama, Japan
L.T. Nguyen
Texas Instruments Inc, Dallas, Texas, United States
A. Ortiz-Conde
Simon Bolivar University, Caracas, Venezuela, Bolivarian Republic of
A. Paskaleva
Bulgarian Academy of Sciences, Sofiya, Bulgaria
P. Perdu
Toulouse Space Centre, Toulouse, France
V.S. Pershenkov
Lomonosov Moscow State University, Moskva, Russian Federation
M.K. Radhakrishnan
J. M. Song
National Chung Hsing University, Taichung, Taiwan
J. Stathis
IBM Research, Yorktown Heights, New York, United States
V. Szekely
Budapest University of Technology and Economics, Budapest, Hungary
S. Terashima
M. Vanzi
University of Cagliari, Cagliari, Italy
S.H. Voldman
J.W.C. de Vries
G.Q.K. Zhang
NXP Semiconductors NV, Eindhoven, Netherlands
M. Zwolinksi
University of Southampton, Southampton, United Kingdom