Microelectronics International (MI) provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:

Advanced packaging
Ceramics
Chip attachment
Chip on board (COB)
Chip scale packaging
Flexible substrates
MEMS
Micro-circuit technology
Microelectronic materials
Multichip modules (MCMs)
Organic/polymer electronics
Printed electronics
Semiconductor technology
Solid state sensors
Thermal management
Thick/thin film technology
Wafer scale processing