The first international journal devoted exclusively to the subject, Journal of Thermal Stresses publishes refereed articles on the theoretical and industrial applications of thermal stresses. Intended as a forum for those engaged in analytic as well as experimental research, this monthly journal includes papers on mathematical and practical applications. Emphasis is placed on new developments in thermoelasticity, thermoplasticity, and theory and applications of thermal stresses. Papers on experimental methods and on numerical methods, including finite element methods, are also published.
All submitted manuscripts are subject to initial appraisal by the Editor, and, if found suitable for further consideration, to peer review by an independent, anonymous expert referee or referees. All submission is online via ScholarOne Manuscripts. 
 

Editor-in-Chief
MARTIN OSTOJA-STARZEWSKI
University of Illinois at Urbana-Champaign, USA 
 
Honorary Editor 

RICHARD B. HETNARSKI -
St. Raphael, Unit 1209 
7117 Pelican Bay Blvd. 
Naples, Florida, 34108 
 

Editorial Board 

FUMIHIRO ASHIDA - Shimane University, Japan 
MONCEF AOUADI – Université de Carthage, Tunisia 
J.R. BARBER - University of Michigan, USA 
ROMESH C. BATRA - Virginia Polytechnic Institute & State University, USA 
VICTOR BIRMAN - Missouri University of Science and Technology, USA 
ERASMO CARRERA - Politechnico di Torino, Italy 
CHING-KONG CHAO - National Taiwan University of Science and Technology, Taiwan 
WEI-QIU CHEN - Zhejiang University, P.R. China 
STAN CHIRITA - University of Iasi, Romania 
MICHELE CIARLETTA - University of Salerno, Italy 
M. REZA ESLAMI  - Amirkabir University of Technology, Iran 
ARTUR GANCZARSKI - Krako University of Technology, Poland 
CUN-FA GAO - Nanjing University of Aeronautics and Astronautics, China 
DORIN IESAN - University of Iasi, Romania 
JÓZEF IGNACZAK - Polish Academy of Sciences, Poland 
SANTOSH KAPURIA - Indian Institute of Technology, New Delhi, India 
YASER KIANI - Shahrekord University, Iran
SHIRONG LI -  Yangzhou University, Jiangsu, China 
CHEE W. LIM - City University of Hong Kong, China 
LARS-ERIK LINDGREN - Lulea University of Technology, Sweden 
PIER MARZOCCA - RMIT University, Australia 
ADRIANO MONTANARO - University of Padova, Italy 
ZENON MRÓZ - Polish Academy of Sciences, Poland 
NAOTAKE NODA - Shizuoka University, Japan 
YOSHIHIRO OOTAO - Osaka Prefecture University, Japan 
MOHAMED I.A. OTHMAN - Zagazig University, Egypt 
YURIY POVSTENKO - Jan Dlugosz University of Czestochowa, Poland 
RAMON QUINTANILLA - Polytechnical University of Catalonia, Spain 
PETER SCHIAVONE - University of Alberta, Canada 
MARINA V. SHITIKOVA - Voronezh State Technical University, Russia 
MERAB SVANADZE - Ilia State University, Georgia 
JAN TALER - Krakow University of Technology, Poland 
KUMAR K. TAMMA - University of Minnesota, USA 
THEODORE R. TAUCHERT - University of Kentucky, USA 
VINCENZO TIBULLO - University of Salerno, Italy 
YURIY TOKOVYY - Pidstryhach IAPMM, Lviv, Ukraine 
ANDRZEJ TYLIKOWSKI - Warsaw University of Technology, Poland 
SEI UEDA - Osaka Institute of Technology, Japan 
XINWEI WANG - Iowa State University, USA
FAN YANG - Tongji University, China 
XIAO-JUN YANG - China University of Mining and Technology, China