当前位置: X-MOL首页最新SCI期刊查询及投稿分析系统 › IEEE Transactions on Device and Materials Reliability杂志
IEEE Transactions on Device and Materials Reliability
基本信息
期刊名称 IEEE Transactions on Device and Materials Reliability
IEEE T DEVICE MAT RE
期刊ISSN 1530-4388
期刊官方网站 https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=7298
是否OA No
出版商 Institute of Electrical and Electronics Engineers Inc.
出版周期 Quarterly
文章处理费 登录后查看
始发年份
年文章数 72
最新影响因子 2.5(2023)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术4区 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气4区
PHYSICS, APPLIED 物理:应用4区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 4.8 0.436 1.148
Engineering
Safety, Risk, Reliability and Quality
65/207 68%
Engineering
Electrical and Electronic Engineering
274/797 65%
Materials Science
Electronic, Optical and Magnetic Materials
103/284 63%
补充信息
自引率 4%
H-index 63
SCI收录状况 Science Citation Index Expanded
官方审稿时间 登录后查看
网友分享审稿时间 数据统计中,敬请期待。
接受率 登录后查看
PubMed Central (PMC) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1530-4388%5BISSN%5D
投稿指南
期刊投稿网址 http://mc.manuscriptcentral.com/tdmr
收稿范围
IEEE Transactions on Device and Materials Reliability includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectations. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.
收录体裁
投稿指南
投稿模板
参考文献格式
编辑信息

                                
我要分享  (欢迎您来完善期刊的资料,分享您的实际投稿经验)
研究领域:
投稿录用情况: 审稿时间:  个月返回审稿结果
本次投稿点评:
提交
down
wechat
bug