Mechatronics is the synergistic combination of precision mechanical engineering, electronic control and systems thinking in the design of products and manufacturing processes. It relates to the design of systems, devices and products aimed at achieving an optimal balance between basic mechanical structure and its overall control. The purpose of this journal is to provide rapid publication of topical papers featuring practical developments in mechatronics. It will cover a wide range of application areas including consumer product design, instrumentation, manufacturing methods, computer integration and process and device control, and will attract a readership from across the industrial and academic research spectrum. Particular importance will be attached to aspects of innovation in mechatronics design philosophy which illustrate the benefits obtainable by an a priori integration of functionality with embedded microprocessor control. A major item will be the design of machines, devices and systems possessing a degree of computer based intelligence. The journal seeks to publish research progress in this field with an emphasis on the applied rather than the theoretical. It will also serve the dual role of bringing greater recognition to this important area of engineering. 

Mechatronics publishes the following types of papers: 
• Regular Articles should describe original research of high quality in the field of Mechatronics. 
• Review Articles will generally be specially commissioned, however, suggestions for topics and authors are welcomed by the Editor-in-Chief. 
•Technical Notes provide rapid publication of important new contributions. 

Regular Articles 
Review Articles
Technical Notes

Editor-In-Chief
S. O. R. Moheimani
University of Texas at Dallas, 800 West Campbell Road-Mailstop EC-38, Richardson, TX 75083-0688, Texas, Fax: USA, Phone 972-883-4158 Email S. O. R. Moheimani
Deputy Editor-in-Chief
T.H. Lee
National University of Singapore Department of Electrical and Computer Engineering, , Fax: (65) 6777 3847 Email T.H. Lee
Senior Editors
Dong-il Cho
Seoul National University, Seoul, Korea
J.T. Gravdahl
Norwegian University of Science & Technology NTNU, Trondheim, Norway
O. Sawodny
University of Stuttgart, Germany
Dr.-Ing. C. Ott
German Aerospace Center DLR Oberpfaffenhofen Site, Oberpfaffenhofen-Wessling, Germany
T. Tsao
University of California at Los Angeles (UCLA), Los Angeles, United States
J. Wang
University of Texas at Austin Department of Mechanical Engineering, Austin, Texas, United States
T. Yamaguchi
Core Technology R&D Center, Ricoh Company, Ltd., Minato-Ku, Japan
Associate Editors
T. Atsumi
Chiba Institute of Technology, Japan
J. Bae
Ulsan National Institute of Science and Technology, Korea, Republic of
K. Barton
University of Michigan, United States
R.D Ben-Mrad
University of Toronto, Canada
K. Bouazza-Marouf
Loughborough University, United Kingdom
M. Boudaoud
Sorbonne University Pierre and Marie Curie Campus, France
D. Bristow
Missouri University of Science and Technology, United States
J.Y. Chang
National Tsing Hua University, Taiwan
Y. Chen
Arizona State University, United States
Y. Q. Chen
University of California Merced, United States
Z. Chen
The University of Newcastle, Australia
G. Cherubini
IBM Zurich Research Laboratory, Switzerland
C. C. Chung
Hanyang University, Korea, Republic of
G. Clayton
Villanova University, USA
R. Dixon
Loughborough University, United Kingdom
C. Fantuzzi
University of Modena and Reggio Emilia, Italy
V. Feliu
University of Castilla La Mancha Higher Technical School of Industrial Engineering, Spain
M. Gauthier
FEMTO-ST Department of Optics, France
J. Gorman
National Institute of Standards and Technology, USA
S. Haliyo
Sorbonne University, France
M.F. Heertjes
University of Technology Eindhoven, Netherlands
P. Hehenberger
University of Applied Sciences Upper Austria, Austria
D. Hoelzle
OHIO STATE UNIVERSITY, United States
H.R. Karimi
Polytechnic of Milan Department of Mechanical Engineering, Italy
W. Kemmetmueller
TU Wien University, Austria
T. K. Kiong
National University of Singapore, Singapore
B. Koch
University of Alberta, Canada
K. Kong
Sogang University, The Republic of Korea
R.G. Landers
Missouri University of Science and Technology, Rolla, Missouri, USAhttp://web.mst.edu/~landersr
K. Leang
The University of Utah, USA
Y. Li
University of Macau, Macao
Y. Li
University of Texas at Dallas, USA
W.H. Liao
Chinese University of Hong Kong, Hong Kong
L. Liu
Chinese Academy of Sciences, China
L. MASIA
Nanyang Technological University, Singapore
G. Magnani
Polytechnic University of Milan, Italy
C. Manzie
The University of Melbourne, Australia
M. Moallem
Simon Fraser University, Canada
R.T. M’Closkey
University of California Los Angeles Department of Mechanical and Aerospace Engineering, United States
D. Oetomo
The University of Melbourne, Australia
K. Oldham
University of Michigan, USA
T.A.E Oomen
University of Technology Eindhoven, Netherlands
R. Padhi
Indian Institute of Science, India
M. Porfiri
New York University, United States
M. Rakotondrabe
Franche-Comte University, France
P. Rocco
Polytechnic University of Milan, Milano, Italy
M. Ruderman
University of Agder, Norway
J. Scruggs
University of Michigan, United States
S. Shirinzadeh
Monash University, Australia
K.-T. Song
National Chiao Tung University, Taiwan
K.A. Stelson
University of Minnesota, United States
C. Su
Concordia University, Canada
D. Sun
City University of Hong Kong, Hong Kong
F. Sun
Tsinghua University, China
M. Takeshi
Saitama University, Japan
M. Tavokoli
University of Alberta, Edmonton, Canada
Q. Wang
Pennsylvania State University, United States
J. Wu
Tsinghua University, China
J Yi
Rutgers The State University of New Jersey, USA
Q. Zou
Rutgers University Department of Mechanical and Aerospace Engineering, United States
L. Zuo
Virginia Tech Research Center Department of Mechanical Engineering, United States
Advisory Board Members
R. Goodall
Loughborough University, United Kingdom
K. Janschek
TU Dresden, Dresden, Germany
A. Kugi
TU Wien University, Wien, Austria
M. Steinbuch
University of Technology Eindhoven, Netherlands
M. Tomizuka
University of California Los Angeles
Former Editors
R.W. Daniel
J. Hewit
C. Melchiorri
G. Monkman